RT/duroid 6202 2-Layer 0.2mm ENIG PCB for High-Frequency Microwave Applications

1.Introduction

Rogers RT/duroid 6202 high frequency circuit materials are low loss and low dielectric constant laminates with limited woven glass reinforcement. It offers electrical and mechanical properties essential in designing complex microwave structures that are mechanically reliable and electrically stable. Excellent dimensional stability (0.05 to 0.07 mils/inch) is achieved by the addition of limited woven glass reinforcement. This often eliminates double etching to achieve tight positional tolerances.

2.Key Features

Dielectric constant (Dk) of 2.94 ±0.04 to 3.06 ±0.04 depending on thickness, 10GHz/23°C
The DK of 0.005″ laminates are 3.06 ± 0.04
0.010″ and 0.015″ laminates are 3.02 ± 0.04
≥0.020″ laminates are 2.94 ± 0.04
Dissipation factor of 0.0015 at 10 GHz/23°C
Low thermal coefficient of Dk at 5 ppm/°C, at 10 GHz ranging -50 to +150°C
Coefficient of Thermal Expansion (-55 to 288 °C) X-axis of 15, Y of 15, Z of 30 ppm/°C
Td 500 °C TGA
Thermal Conductivity of 0.68 W/m/k
Moisture Absorption of 0.04%
UL 94-V0

3.Benefits

Low loss for excellent high frequency performance
In-plane expansion coefficient matched to copper
Excellent electrical and mechanical properties
Very low etch shrinkage

4.PCB Construction Details

5.PCB Stackup (2-Layer Rigid Structure)

Copper layer 1 - 35 μm
Rogers RT/duroid 6202 Substrate - 5mil (0.127mm)
Copper layer 2 - 35 μm

6.PCB Statistics:

Components: 3
Total Pads: 16
Thru Hole Pads: 10
Top SMT Pads: 6
Bottom SMT Pads: 0
Vias: 8
Nets: 2

7.Typical Applications

Phased Array Antennas
Ground Based and Airborne Radar Systems
Global Positioning System Antennas
Power Backplanes
Commercial Airline Collision Avoidance
Beam Forming Networks

8.Quality Assurance

IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support