Rogers RO3010 0.254mm Double-Sided PCB with ENIG Finish for High-Dk RF Applications
1.Introduction to Core Technologies
RO3010 is a high-dielectric-constant ceramic-filled PTFE composite from Rogers' RO3000 series, specifically designed for commercial microwave and RF applications requiring high Dk values in compact circuit designs. With a dielectric constant of 10.2 ± 0.30 at 10 GHz, RO3010 enables significant circuit size reduction while maintaining excellent electrical performance.
The material features mechanical properties consistent with other RO3000 series laminates, allowing designers to combine different dielectric constant materials in multilayer designs without warpage or reliability concerns.
2.RO3010 Key Features and Benefits
High Dk 10.2 ± 0.30 at 10 GHz enables compact circuit designs with reduced wavelength
Low Df 0.0022 at 10 GHz minimizes signal loss for high-frequency circuits
CTE 13-16 ppm/°C (X/Y) matched to copper for excellent dimensional stability
Z-axis CTE 16 ppm/°C ensures reliable plated through-holes in thermal environments
Td 500°C provides high thermal decomposition temperature for lead-free processing
Volume and surface resistivity 10⁵ MΩ ensures good insulation performance
UL 94 V-0 rated for safety compliance
Consistent mechanical properties across different Dk values enables hybrid multilayer designs
Moisture absorption 0.05% maintains electrical stability in humid conditions
Copper peel strength 9.4 lbs/in after solder float ensures reliable copper adhesion
4.RO3010 Data Sheet Summary
| Property |
Conditions |
Typical Value |
Unit |
Test Method |
| Dielectric Constant (process) | @ 10 GHz, 23°C | 10.2 ± 0.30 | - | IPC TM-650 2.5.5.5 |
| Dielectric Constant (design) | 8 GHz - 40 GHz | 11.20 | - | Differential Phase Length |
| Dissipation Factor | @ 10 GHz, 23°C | 0.0022 | - | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Dk | -50 to 150°C, 10 GHz | -395 | ppm/°C | IPC TM-650 2.5.5.5 |
| Volume Resistivity | Condition A | 10⁵ | MΩ-cm | IPC TM-650 2.5.17.1 |
| Surface Resistivity | Condition A | 10⁵ | MΩ | IPC TM-650 2.5.17.1 |
| Decomposition Temperature (Td) | TGA | 500 | °C | ASTM D3850 |
| CTE - X axis | -55 to 288°C | 13 | ppm/°C | IPC TM-650 2.4.41 |
| CTE - Y axis | -55 to 288°C | 11 | ppm/°C | IPC TM-650 2.4.41 |
| CTE - Z axis | -55 to 288°C | 16 | ppm/°C | IPC TM-650 2.4.41 |
| Thermal Conductivity | 50°C | 0.95 | W/(m·K) | ASTM D5470 |
| Copper Peel Strength | 1 oz EDC after solder float | 9.4 | lbs/in | IPC TM-650 2.4.8 |
| Young's Modulus | 23°C | 1902 / 1934 | MPa | ASTM D638 |
| Dimensional Stability (MD) | Condition A | -0.35 | mm/m | IPC TM-650 2.2.4 |
| Dimensional Stability (CMD) | Condition A | -0.31 | mm/m | IPC TM-650 2.2.4 |
| Flammability | UL 94 | V-0 | - | UL 94 |
| Moisture Absorption | D48/50 | 0.05 | % | IPC TM-650 2.6.2.1 |
| Density | 23°C | 2.8 | g/cm³ | ASTM D792 |
| Specific Heat Capacity | Calculated | 0.8 | J/g/K | Calculated |
| Lead Free Process Compatible | - | Yes | - | - |
5.PCB Specifications
| Item | Specification |
|---|
| Product Type | Double-Sided High-Dk RF PCB |
| Material | Rogers RO3010 |
| Substrate Thickness | 0.254mm (10 mil) |
| Copper Thickness | 1oz (approx. 35μm) both layers |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Solder Mask | None |
| Silkscreen | Black (top side only) |
| Dimensions | 65mm x 57mm = 1 PC |
6.1 PCB Stackup (2-Layer Rigid Structure)
Top Layer (L1): 1oz Copper with black silkscreen
Substrate: Rogers RO3010, 0.254mm
Bottom Layer (L2): 1oz Copper
7.Typical Applications
Cellular Infrastructure: Power amplifiers, filters, couplers
Satellite Communications: LNB, feed networks, combiners
Automotive Radar: 24GHz/77GHz sensors
Test & Measurement: High-frequency probes, fixtures
Aerospace & Defense: Radar modules, telemetry systems
IoT & Wireless: Compact antenna designs, impedance matching networks
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
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