Home > Newly Shipped PCB > Rogers RO4003C LoPro 2-Layer 16.7mil Low-Loss PCB with ENEPIG Finish

Rogers RO4003C LoPro 2-Layer PCB
PCB Material:Rogers RO4003C LoPro / 16.7mil (0.424mm)
MOQ:1PCS
Price:2.99-99 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:5-9 working days
Payment Method:T/T, Paypal
 

Rogers RO4003C LoPro 2-Layer 16.7mil Low-Loss PCB with ENEPIG Finish


1.Introduction of Core

RO4003C LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining the other desirable attributes of the standard RO4003C laminate system. RO4003C hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes and do not require specialized via preparation such as sodium etch for lower manufacturing cost.


2.Key Features

Dielectric constant of 3.38 +/- 0.05 at 10 GHz/23°C
Dissipation factor of 0.0027 at 10 GHz/23°C
Td > 425°C, High Tg greater than 280°C TMA
High Thermal Conductivity of 0.64 W/mK
Low Z-axis coefficient of thermal expansion at 46 ppm/°C
Copper matched Coefficient of Thermal Expansion (-55 to 288°C): X axis 11 ppm/°C, Y axis 14 ppm/°C
Lead free Process Compatible


3.Benefits

Lower insertion loss allows for higher operating frequency designs (even greater than 40 GHz)
Reduced passive inter-modulation (PIM) for base station antennas
Improved thermal performance due to lower conductor loss
Multilayer PCB capability
Design flexibility
High temperature processing compatibility
Meets environmental concerns
CAF resistant
Standard epoxy/glass (FR-4) fabrication processes without specialized via preparation


Rogers RO4003C LoPro PCB


4.PCB Construction Details

Specification Value
Base MaterialRO4003C Low Profile
Layer CountDouble-Layer
Board Dimensions104.3mm × 78.65mm
Minimum Trace/Space4/6 mils
Minimum Hole Size0.4mm
Blind ViasNo
Finished Board Thickness0.5mm
Finished Cu Weight (Outer Layers)1 oz (1.4 mils)
Via Plating Thickness20 μm
Surface FinishENEPIG
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskGreen
Bottom Solder MaskNo
Electrical Test100% prior to shipment

5.PCB Stackup (2-Layer Rigid Structure)

Copper layer 1 – 35 μm
Rogers RO4003C LoPro Substrate – 0.424 mm (16.7mil)
Copper layer 2 – 35 μm


6.PCB Statistics:

Components: 56
Total Pads: 102
Thru Hole Pads: 75
Top SMT Pads: 27
Bottom SMT Pads: 0
Vias: 49
Nets: 2


7.Typical Applications

Digital applications such as servers, routers, and high speed back planes
Cellular base station antennas and power amplifiers
LNB's for direct broadcast satellites
RF Identification Tags


8.Quality Assurance

Artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-2
Availability: Worldwide


 

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