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Rogers Kappa 438 2-Layer PCB
PCB Material:Rogers Kappa 438 / 30mil (0.762mm)
MOQ:1PCS
Price:1.99-89 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:5-8 working days
Payment Method:T/T, Paypal
 

Rogers Kappa 438 2-Layer 30mil High-Frequency PCB with ENIG Finish


1.Introduction of Core

Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible. Standard thicknesses include 10, 20, 30, 40 and 60 mil.


Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.


2.Key Features

Glass reinforced hydrocarbon thermoset platform
Dk of 4.38 is tailored to FR-4 industry standard norms
Tighter Dk and thickness tolerance than FR-4
Low Z Axis CTE of 42 ppm/°C
High Tg of > 280°C TMA
Thermal coefficient of Dk of -21 ppm/°C during -50°C to 150°C
Meets UL 94-V0 requirements


3.Benefits

Ease of PCB manufacturing and assembly in line with FR-4
Design Dk enables ease of converting existing FR-4 designs needing better electrical performance
Consistent circuit performance
Improved design flexibility and plated through-hole reliability
Automated assembly compatible
Low loss material with cost-effective fabrication


Rogers Kappa 438 PCB


4.PCB Construction Details

Specification Value
Base MaterialKappa 438
Layer Count2 layers
Board Dimensions45.5mm × 32mm (±0.15mm)
Minimum Trace/Space5/6 mils
Minimum Hole Size0.2mm
Blind ViasNo
Finished Board Thickness0.85mm
Finished Cu Weight (Outer Layers)1 oz (1.4 mils)
Via Plating Thickness20 μm
Surface FinishENIG
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
Electrical Test100% prior to shipment

5.PCB Stackup (2-Layer Rigid Structure)

Copper layer 1 – 35 μm
Rogers Kappa 438 – 0.762 mm (30mil)
Copper layer 2 – 35 μm


6.PCB Statistics:

Components: 51
Total Pads: 43
Thru Hole Pads: 25
Top SMT Pads: 18
Bottom SMT Pads: 0
Vias: 51
Nets: 2


7.Typical Applications

Carrier Grade WiFi/Licensed Assisted Access (LAA)
Small Cell and Distributed Antenna Systems (DAS)
Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)
Internet of Things (IoT) Segments: Smart Home and Wireless Meters


8.Quality Assurance

Artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-2
Availability: Worldwide


 

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