Rogers TMM4 2-Layer 15mil Ceramic-Filled Thermoset PCB with Immersion Gold Finish

1.Introduction to Core Technologies

The TMM4 laminate is a ceramic-filled, hydrocarbon-based thermoset polymer composite developed by Rogers Corporation. It is engineered to deliver high reliability in plated-through-hole (PTH) structures, particularly for strip-line and micro-strip RF and microwave circuits.

TMM4 combines the mechanical and chemical robustness of ceramics with the processability of traditional PTFE materials—without requiring specialized fabrication techniques. Its thermoset resin composition ensures excellent wire-bonding reliability, free from pad lifting or substrate deformation under thermal or mechanical stress.

2.Key Performance Characteristics:

Dielectric constant (Dk): 4.50 ± 0.045 at 10GHz
Dissipation factor: 0.0020 at 10GHz
Thermal coefficient of Dk: 15 ppm/°K
CTE (x/y): 16 ppm/°K, CTE (z): 21 ppm/°K
Decomposition temperature (Td): 425°C (TGA)
Thermal conductivity: 0.7 W/m·K
Moisture absorption: 0.07%–0.18%
Available thickness range: 0.0015” to 0.500” (±0.0015”)

3.Benefits

Resists creep and cold flow due to thermoset structure
Compatible with standard PWB processes
High PTH reliability for multi-layer and double-board designs
Chemically resistant to fabrication process chemicals
Excellent for wire-bonding applications without pad lifting

4.PCB Details

5.PCB Stackup (2-Layer Rigid Structure)

Copper Layer 1 – 35 μm
Rogers TMM4 Core – 0.381 mm (15mil)
Copper Layer 2 – 35 μm

6.PCB Statistics

Components: 23
Total Pads: 42
Thru Hole Pads: 12
Top SMT Pads: 30
Bottom SMT Pads: 0
Vias: 36
Nets: 2

7.Typical Applications

RF and microwave circuitry
Power amplifiers and combiners
Filters and couplers
Satellite communication systems
GPS patch antennas
Dielectric polarizers and lenses
Semiconductor chip testers

8. Quality Assurance

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide