TU-768 PCB 2-Layer 1.6mm Thick High-Performance Epoxy Laminates for Consumer Electronics

1. Introduction of TU-768

TUC's TU-768 and TU-768P laminates and prepregs are crafted from high-quality woven E-glass infused with an epoxy resin system. This design imparts UV-blocking characteristics and ensures compatibility with automated optical inspection (AOI) processes. These materials are ideal for circuit boards that must endure severe thermal cycles or extensive assembly procedures. TU-768 laminates demonstrate excellent coefficients of thermal expansion (CTE), superior chemical resistance, thermal stability, and resistance to conductive anodic filament (CAF) formation.

2. Typical Properties

Glass transition temperature (Tg) measured by DSC is 180°C.
Compatible with lead-free processing.
Excellent thermal expansion coefficients: X-Axis of 11-15 ppm/°C and Y-Axis of 11-15 ppm/°C.
Time to delaminate (copper removed) measured by TMA: T260 of 60 minutes and T288 of 15 minutes.
Dielectric constant (DK) of 4.3 at both 5 GHz and 10 GHz, and ranges from 4.3 to 4.4 at 1 GHz.
Dissipation factor (Df) or loss tangent: 0.023 at 10 GHz, 0.021 at 5 GHz, and between 0.019 and 0.018 at 1 GHz.
Anti-CAF properties.
Superior chemical and thermal resistance.
Fluorescent properties suitable for AOI.
Moisture absorption of 0.18%.
Flammability rating (laminate and laminated prepreg) of UL94-V0.

3. PCB Stack-up: 2-layer Rigid PCB
Copper Layer 1: 35 µm
TU-768 Core: 1.5 mm (60 mil)
Copper Layer 2: 35 µm

4. PCB Construction Details
Board dimensions: 110 mm x 197 mm = 1 piece, +/- 0.15 mm.
Minimum trace/space: 4/4 mils.
Minimum hole size: 0.3 mm.
No blind vias.
Finished board thickness: 1.6 mm.
Finished copper weight: 1 oz (1.4 mils) on outer layers.
Via plating thickness: 20 µm.
Surface finish: Hot Air Solder Level (HASL).
Top silkscreen: White.
Bottom silkscreen: None.
Top solder mask: Green.
Bottom solder mask: Green.
100% electrical testing conducted prior to shipment.

5. PCB Statistics:

Components: 41.
Total pads: 152.
Through-hole pads: 97.
Top SMT pads: 45.
Bottom SMT pads: 0.
Vias: 51.
Nets: 2.

6. Type of Artwork Supplied:
Gerber RS-274-X

7.Quality Standard:
IPC-Class-2

8. Availability:
Worldwide

9. Some Typical Applications

Consumer electronics.
Servers and workstations.
Automotive applications.