TLX-8 PCB 2-Layer 30mil High-Frequency PTFE Fiberglass Laminates for Radar and Mobile Communications

1. TLX-8 Introduction

TLX-8 is a type of PTFE fiberglass laminate designed for high-volume antenna applications, delivering reliability across various RF uses. This versatile material is available in numerous thicknesses and copper cladding options, making it suitable for low-layer microwave designs. It offers mechanical reinforcement in challenging environments, such as:

Resistance to creep for printed wiring boards (PWBs) attached to housings that experience significant vibration during space launches.
Durability under high temperatures in engine modules.
Radiation resistance suitable for space applications (refer to NASA's guidelines for low outgassing materials).
Robustness in extreme maritime conditions for warship antennas.
Stability across a wide temperature range for altimeter substrates during flight.

2. Benefits

Outstanding passive intermodulation (PIM) values in PCBs (measured below -160 dBc).
Superior mechanical and thermal properties.
Low and stable dielectric constant (Dk).
Exceptional dimensional stability.
Minimal moisture absorption.
Tightly controlled dielectric constant.
Low dissipation factor (DF).
UL 94 V0 rating.
Ideal for low-layer microwave designs.

3.Main Properties
Electrical Properties
Dielectric Constant @ 10 GHz - 2.55 ± 0.04 - IPC-650 2.5.5.3
Dissipation Factor @ 10 GHz - 0.0018 - IPC-650 2.5.5.5.1

Surface Resistivity Elevated Temp. 6.605 x 10^8 Mohm IPC-650 2.5.17.1 Sec. 5.2.1
Surface Resistivity Humidity Cond. 3.550 x 10^6 Mohm IPC-650 2.5.17.1 Sec. 5.2.1
Volume Resistivity Elevated Temp. 1.110 x 10^10 Mohm/cm IPC-650 2.5.17.1 Sec. 5.2.1
Volume Resistivity Humidity Cond. 1.046 x 10^10 Mohm/cm IPC-650 2.5.17.1 Sec. 5.2.1

Dimensional Stability
MD After Bake 0.06 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.4
CD After Bake 0.08 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.4
MD Thermal Stress 0.09 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.5
CD Thermal Stress 0.10 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.5

CTE (25-260 °C)
X - 21 ppm/°C - IPC-650 2.4.41/ASTM D 3386
Y - 23 ppm/°C - IPC-650 2.4.41/ASTM D 3386
Z - 215 ppm/°C - IPC-650 2.4.41/ASTM D 3386

Td
2% Weight Loss - 535 °C - IPC-650 2.4.24.6 (TGA)
5% Weight Loss - 553 °C - IPC-650 2.4.24.6 (TGA)

Chemical / Physical Properties
Moisture Absorption - 0.02 % IPC-650 2.6.2.1
Dielectric Breakdown - > 45 Kv - IPC-650 2.5.6
Flammability Rating - V-0 - UL-94

4. PCB Stackup: 2-layer rigid PCB

Copper Layer 1: 35 µm
Taconic TLX-8 Core: 0.762 mm (30 mil)
Copper Layer 2: 35 µm

5. PCB Construction Details
Board Dimensions: 85 mm x 77 mm (1 piece, ± 0.15 mm)
Minimum Trace/Space: 5/5 mils
Minimum Hole Size: 0.3 mm
No blind vias.
Finished Board Thickness: 0.8 mm
Finished Copper Weight: 1 oz (1.4 mils) on outer layers
Via Plating Thickness: 20 µm
Surface Finish: Immersion Gold
Top Silkscreen: White
Bottom Silkscreen: None
Top Solder Mask: None
Bottom Solder Mask: None
100% electrical testing conducted before shipment

6. PCB Statistics:

Components: 26
Total Pads: 48
Through Hole Pads: 25
Top SMT Pads: 23
Bottom SMT Pads: 0
Vias: 32
Nets: 2

7. Type of Artwork Supplied:
Gerber RS-274-X

8.Quality Standard:
IPC-Class-2

9. Availability:
Worldwide

10. Some Typical Applications

Radar systems
Mobile communications
Microwave test equipment
Microwave transmission devices
Couplers, splitters, combiners, amplifiers, and antennas