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WL-CT350 2-Layer PCB
PCB Material:WL-CT350 / 40mil (1.016mm)
MOQ:1PCS
Price:2.99-109 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:5-9 working days
Payment Method:T/T, Paypal
 

WL-CT350 2-Layer 40mil High-Frequency PCB with Immersion Gold


1.Introduction

Wangling's WL-CT350 organic polymer ceramic fiberglass cloth-covered copper clad laminates are a thermosetting resin-based high-frequency materials. The composition of the dielectric layer includes hydrocarbon resin, ceramics, and fiberglass cloth. It exhibits low loss performance, meeting the requirements for high-frequency designs. PCB processing can be carried out using techniques similar to FR4 materials, making it simpler compared to PTFE materials and ensuring better stability and consistency in circuitry. It can be used as a substitute for similar foreign products.


The combination of hydrocarbon resin and composite ceramics provides excellent low loss, high-temperature resistance, and temperature stability characteristics. The series of materials have a stable temperature coefficient of dielectric constant and loss, low thermal expansion coefficient, and a high TG value of above 280°C.


2.Key Features

Dielectric constant of 3.48 at 10 GHz/23°C
Dissipation factor of 0.0039 at 10GHz
Excellent TCDK of 52 ppm/°C
High Thermal conductivity of 0.7 W/MK
Low Moisture Absorption 0.05%
Matched to copper CTE in X-axis of 11ppm/°C, Y-axis of 14 ppm/°C and Z-axis of 34 ppm/°C


3.Benefits

Low loss performance suitable for high-frequency designs
High-temperature resistance and excellent thermal stability
Compatible with standard FR4 processing techniques
Stable dielectric constant and loss temperature coefficient
Low thermal expansion coefficient and high Tg value (>280°C)
Can serve as a substitute for similar imported materials


WL-CT350 PCB


4.PCB Construction Details

Specification Value
Base MaterialWL-CT350
Layer Count2-layer
Board Dimensions41.8mm × 51.35mm (±0.15mm)
Minimum Trace/Space5/7 mils
Minimum Hole Size0.3mm
Blind ViasNo
Finished Board Thickness1.1mm
Finished Cu Weight (Outer Layers)1oz (1.4 mils)
Via Plating Thickness20 µm
Surface FinishImmersion Gold
Top SilkscreenBlack
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
Electrical Test100% prior to shipment

5.PCB Stackup (2-Layer Rigid Structure)

Copper layer 1 – 35 µm
WL-CT350 – 1.016 mm (40mil)
Copper layer 2 – 35 µm


6.PCB Statistics:

Components: 21
Total Pads: 63
Thru Hole Pads: 39
Top SMT Pads: 24
Bottom SMT Pads: 0
Vias: 29
Nets: 2


7.Typical Applications

Base station antennas and satellite antennas
Automotive radar, sensors, and navigation systems
Power amplifiers
Satellite high-frequency heads
RF devices and filters
WIMAX antennas and distributed antennas


8.Quality Assurance

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide


 

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