Home > Newly Shipped PCB > Wangling F4BTMS615 2-Layer 0.254mm Immersion Tin PCB for Aerospace Applications

Wangling F4BTMS615 2-Layer PCB
PCB Material:Wangling F4BTMS615 / 0.254mm (10mil)
MOQ:1PCS
Price:1.99-99 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:6-11 working days
Payment Method:T/T, Paypal
 

Wangling F4BTMS615 2-Layer 0.254mm Immersion Tin PCB for Aerospace Applications


1.Introduction to Core Technologies

The F4BTMS series is an upgraded version of the F4BTM series. It has achieved a technological breakthrough in material formulation and manufacturing processes. The material has been enriched with a significant amount of ceramics and reinforced with ultra-thin and ultra-fine glass fiber cloth, resulting in substantial improvements in material performance and a broader range of dielectric constants. It is a high-reliability material suitable for aerospace applications and can replace similar foreign products.


By incorporating a small amount of ultra-thin and ultra-fine glass fiber cloth and a large amount of uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin, the negative effects of glass fiber on electromagnetic wave propagation are minimized. This reduces dielectric loss, enhances dimensional stability, and decreases the X/Y/Z anisotropy of the material. It also increases the usable frequency range, improves electrical strength, and enhances thermal conductivity. Additionally, the material exhibits excellent low thermal expansion coefficient and stable dielectric temperature characteristics.


The F4BTMS series comes with RTF low roughness copper foil as a standard feature, which reduces conductor loss and provides excellent peel strength. It can be used with either copper or aluminum bases.


2.Key Performance Characteristics:

Dielectric constant (Dk) of 6.15 at 10GHz
Dissipation factor of 0.0020 at 10GHz, 0.0023 at 20GHz
CTE x-axis of 10 ppm/°C, CTE y-axis of 12 ppm/°C, CTE z-axis of 40 ppm/°C, -55°C to 288°C
Low thermal coefficient of Dk at -96 ppm/°C, -55°C to 150°C
High Thermal conductivity of 0.67 W/mk
Moisture absorption of 0.1%


3.PCB Details

Parameter Specification
Base MaterialF4BTMS615
ManufacturerWangling
Layer Count2 layers
Board Dimensions45.8mm × 102.1mm = 1PC, ±0.15mm
Minimum Trace/Space4/5 mils
Minimum Hole Size0.3mm
Blind ViasNo
Finished Board Thickness0.3mm
Finished Cu Weight1oz (1.4 mils) outer layers
Via Plating Thickness20 μm
Surface FinishImmersion Tin
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
Electrical Test100% tested prior to shipment

Wangling F4BTMS615 PCB


4.PCB Stackup (2-Layer Rigid Structure)

Copper Layer 1 - 35 μm
F4BTMS615 Core - 0.254 mm (10mil)
Copper Layer 2 - 35 μm


5.PCB Statistics

Components: 18
Total Pads: 42
Thru Hole Pads: 15
Top SMT Pads: 27
Bottom SMT Pads: 0
Vias: 35
Nets: 2


6.Typical Applications

Aerospace equipment, space and cabin equipment
Microwave, RF
Radar, military radar
Feed networks
Phase-sensitive antennas, phased array antennas
Satellite communications, and more


7. Quality Assurance

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide


 

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