Rogers CuClad 217 2-Layer 20mil ENIG PCB for Microwave & Radar Systems
1.Introduction to Core Technologies
Rogers CuClad 217 laminates are cross plied, woven fiberglass and precisely controlled PTFE composite laminates that offer low dielectric constant values of 2.17 or 2.20. CuClad 217 laminate's cross plied construction provides in-plane electrical and mechanical isotropy. CuClad 217 uses a low fiberglass/PTFE ratio to provide the lowest dielectric constant (Dk) and dissipation factor available in fiberglass reinforced PTFE based laminates. Together, these properties offer faster signal propagation and higher signal/noise ratios.
2.Key Performance Characteristics:
Dielectric Constant of DK 2.17 or 2.2 at 10GHz / 1MHz
Dissipation Factor of 0.0009 at 10GHz
Low Moisture Absorption of 0.02%
Strong Peel Strength of 14 lbs/in
Low outgassing Total Mass Loss (TML) 0.01%, Collected Volatile Condensable Material (CVCM) 0.01% and 0 Water Vapor Regain (WVR)
Cross Plied Woven Fiberglass, alternating plies are oriented 90 degree to each other
High PTFE to Glass Ratio
Better dielectric constant uniformity than comparable non-woven fiberglass reinforced laminates
3.Benefits
Stable Dk over a wide frequency range
Low Dk supports wider line widths for lower insertion loss
Low circuit losses at high frequency
Design flexibility in PCB fabrication benefits from improved dimensional stability
Enables designers to meet strict specifications
Electrical and Mechanical Isotropy in the X-Y Plane
Well Suited for Dk Sensitive Circuits
4.PCB Details
| Parameter |
Specification |
| Base Material | CuClad 217 |
| Manufacturer | Rogers Corporation |
| Layer Count | 2 layers |
| Board Dimensions | 89mm × 56mm = 1PC, ±0.15mm |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.2mm |
| Blind Vias | No |
| Finished Board Thickness | 0.6mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Blue |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper Layer 1 - 35 μm
Rogers CuClad 217 Core - 0.508 mm (20mil)
Copper Layer 2 - 35 μm
6.PCB Statistics
Components: 25
Total Pads: 130
Thru Hole Pads: 105
Top SMT Pads: 25
Bottom SMT Pads: 0
Vias: 45
Nets: 2
7.Typical Applications
Radars
Electronic Countermeasures
Electronic Support Measures
Microwave Components (LNAs, filters, couplers, etc.)
8. Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
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