F4BTMS300 2-Layer 5mil ENIG High Frequency PCB for Aerospace & Radar Applications

(Note: Printed Circuit Boards are custom-made products. Images and parameters are for reference only.)

1. Introduction to F4BTMS300 High Frequency PCB

The F4BTMS series is an upgraded version of the F4BTM series. It has achieved a technological breakthrough in material formulation and manufacturing processes. The material has been enriched with a significant amount of ceramics and reinforced with ultra-thin and ultra-fine glass fiber cloth, resulting in substantial improvements in material performance and a broader range of dielectric constants. It is a high-reliability material suitable for aerospace applications and can replace similar foreign products.

By incorporating a small amount of ultra-thin and ultra-fine glass fiber cloth and a large amount of uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin, the negative effects of glass fiber on electromagnetic wave propagation are minimized. This reduces dielectric loss, enhances dimensional stability, and decreases the X/Y/Z anisotropy of the material. It also increases the usable frequency range, improves electrical strength, and enhances thermal conductivity. Additionally, the material exhibits excellent low thermal expansion coefficient and stable dielectric temperature characteristics.

The F4BTMS series comes with RTF low roughness copper foil as a standard feature, which reduces conductor loss and provides excellent peel strength. It can be used with either copper or aluminum bases.

This 2-layer rigid PCB is constructed entirely with F4BTMS300 as the core material at 5mil (0.127mm) thickness, with ENIG surface finish and 1oz RTF copper on both sides. Its DK of 3.00 offers excellent high-frequency performance, making it ideal for demanding applications such as aerospace equipment, microwave, RF, radar, military radar, phased array antennas, and satellite communications.

2. Key Features of F4BTMS300 PCB

• Dielectric Constant (DK): 3.00 ± 0.04 at 10GHz

• Dissipation Factor (Df): 0.0013 at 10GHz / 0.0015 at 20GHz / 0.0019 at 40GHz

• Ultra-low TCDK: -20 ppm/°C (-55°C to 150°C)

• Ultra-low CTE: X-axis 10 ppm/°C, Y-axis 11 ppm/°C, Z-axis 22 ppm/°C (-55°C to 288°C)

• High Thermal Conductivity: 0.58 W/(M·K)

• Ultra-Low Moisture Absorption: 0.025%

• Peel Strength (1oz RTF): >1.2 N/mm

• Volume Resistivity: ≥1×10⁸ MΩ·cm

• Surface Resistivity: ≥1×10⁸ MΩ

• Electrical Strength (Z direction): >40 KV/mm

• Breakdown Voltage (XY direction): >52 KV

• Density: 2.28 g/cm³

• Long-term Operating Temperature: -55°C to +260°C

• UL 94 V-0 Flammability Rating

• Excellent radiation resistance — stable dielectric and physical properties after irradiation

• Low outgassing — meets aerospace vacuum outgassing requirements

• Excellent dimensional stability

• Low dielectric constant tolerance and excellent batch-to-batch consistency

3. Benefits of F4BTMS300 PCB

• Stable DK (3.00±0.04) — Consistent impedance control for high-frequency designs

• Ultra-Low Df (0.0013 @ 10GHz) — Excellent signal integrity with minimal insertion loss

• Ultra-Low CTE (10/11/22 ppm/°C) — Exceptional dimensional stability, matched to copper

• High Thermal Conductivity (0.58 W/mK) — Superior heat dissipation for high-power applications

• Ultra-Thin Glass Fiber Reinforcement — Minimized glass fiber effect, reduced dielectric loss

• RTF Copper Foil — Reduced conductor loss, excellent peel strength

• Excellent Radiation Resistance & Low Outgassing — Aerospace-grade for space applications

• Frequency Stability up to 40GHz — Stable DK and low loss across wide frequency range

• ENIG Finish — Excellent solderability, corrosion resistance, and wire bondability

4. PCB Construction Details

5. PCB Stackup (2-Layer Rigid Structure)

Layer: Copper_layer_1 (Top), Material: Copper (RTF), Thickness: 35 μm (1 oz)

Layer: Dielectric, Material: F4BTMS300 Core, Thickness: 0.127 mm (5mil)

Layer: Copper_layer_2 (Bottom), Material: Copper (RTF), Thickness: 35 μm (1 oz)

6. PCB Statistics

Components: 42
Total Pads: 38
Thru Hole Pads: 23
Top SMT Pads: 15
Bottom SMT Pads: 0
Vias: 26
Nets: 2

7. Wangling F4BTMS300 Material – Product Introduction

The F4BTMS series is an upgraded version of the F4BTM series. It has achieved a technological breakthrough in material formulation and manufacturing processes. The material has been enriched with a significant amount of ceramics and reinforced with ultra-thin and ultra-fine glass fiber cloth, resulting in substantial improvements in material performance and a broader range of dielectric constants. It is a high-reliability material suitable for aerospace applications and can replace similar foreign products.

By incorporating a small amount of ultra-thin and ultra-fine glass fiber cloth and a large amount of uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin, the negative effects of glass fiber on electromagnetic wave propagation are minimized. This reduces dielectric loss, enhances dimensional stability, and decreases the X/Y/Z anisotropy of the material. It also increases the usable frequency range, improves electrical strength, and enhances thermal conductivity. Additionally, the material exhibits excellent low thermal expansion coefficient and stable dielectric temperature characteristics.

The F4BTMS series comes with RTF low roughness copper foil as a standard feature, which reduces conductor loss and provides excellent peel strength. It can be used with either copper or aluminum bases. F4BTMS294 can be paired with embedded 50Ω resistor copper foil to form resistor film boards.

PCB processing can follow standard PTFE board process technology. The material's excellent mechanical and physical properties make it suitable for multilayer, high-multilayer, and backplane processing. It also demonstrates excellent processability in dense hole and fine line applications.

F4BTMS300 features a dielectric constant of 3.00±0.04 at 10GHz, ultra-low dissipation factor of 0.0013 at 10GHz, 0.0015 at 20GHz, and 0.0019 at 40GHz, along with excellent thermal stability. The material operates reliably across a wide temperature range from -55°C to +260°C and is suitable for high-reliability aerospace applications.

8. Features and Benefits Summary

Feature	Benefit
Low DK tolerance and excellent batch-to-batch consistency	Consistent electrical performance across production batches
Ultra-low dielectric loss	Superior signal integrity for high-frequency designs
Stable DK and low loss up to 40GHz	Meets phase-sensitive application requirements
Excellent frequency and phase stability from -55°C to 150°C	Reliable performance across temperature extremes
Excellent radiation resistance	Stable dielectric and physical properties after irradiation
Low outgassing	Meets aerospace vacuum outgassing requirements
Ultra-low CTE (10/11/22 ppm/°C)	High reliability plated through holes and dimensional stability
High thermal conductivity (0.58 W/mK)	Suitable for high-power applications
Excellent dimensional stability	Consistent performance across varying conditions
Ultra-low moisture absorption (0.025%)	Stable performance in humid environments
ENIG finish	Excellent solderability, corrosion resistance, wire bondability

9. F4BTMS300 Typical Properties (Data Sheet)

10. F4BTMS300 Electrical Performance Characteristics

• Excellent Frequency Stability: The material maintains a stable dielectric constant and low loss values across the 0.5～40GHz frequency range, meeting design requirements across different frequencies.

• Excellent Temperature Stability: TCDK is approximately -20 ppm/°C over the -55～150°C range, with minimal variation. The actual usable temperature of the material far exceeds this range.

11. Primary Application Areas

• Aerospace equipment, space and cabin equipment

• Microwave and RF applications

• Radar and military radar systems

• Feed networks

• Phase-sensitive antennas and phased array antennas

• Satellite communications

• High-reliability aerospace and defense applications

12. Quality Assurance

• Type of artwork supplied: Gerber RS-274-X

• Accepted standard: IPC-Class-2

• Availability: Worldwide

• 100% Electrical test prior to shipment

13. Standard Thickness, Panel Sizes & Claddings

Note: F4BTMS300 minimum thickness is 0.127mm (5mil). Multiples of 0.127mm thickness are available.

Parameter	Options
Standard Dielectric Thicknesses (mm/mil)	0.127mm (5mil), 0.254mm (10mil), 0.508mm (20mil), 0.635mm (25mil), 0.762mm (30mil), 0.787mm (30.1mil), 1.016mm (40mil), 1.270mm (50mil), 1.50mm (59mil), 1.524mm (60mil), 1.575mm (62mil), 2.03mm (80mil), 2.54mm (100mil), 3.175mm (125mil), 4.06mm (160mil), 5.08mm (200mil), 6.35mm (250mil)
Thickness Tolerances (mm)	0.127mm: ±0.0127, 0.254mm: ±0.02, 0.508mm: ±0.03, 0.635mm: ±0.04, 0.762mm: ±0.04, 0.787mm: ±0.04, 1.016mm: ±0.05, 1.270mm: ±0.05, 1.50mm: ±0.06, 1.524mm: ±0.06, 1.575mm: ±0.06, 2.03mm: ±0.08, 2.54mm: ±0.10, 3.175mm: ±0.13, 4.06mm: ±0.18, 5.08mm: ±0.20, 6.35mm: ±0.25
Standard Panel Sizes	305×460mm (12×18"), 460×610mm (18×24"), 610×920mm (24×36")
Standard Claddings	RTF Low-Profile Copper: 0.5oz (18μm), 1oz (35μm); Embedded 50Ω resistor copper foil available
Metal Base Options	F4BTMS***-AL (Aluminum base), F4BTMS***-CU (Copper base) for shielding/heat dissipation

14. F4BTMS Series Aluminum/Copper Base Option

The F4BTMS series can also be provided with an aluminum or copper base, where one side of the dielectric layer is covered with copper foil and the other side is laminated with copper or aluminum for shielding or heat dissipation purposes. Model designation: F4BTMS***-AL or F4BTMS***-CU.

Model	Metal Base	Specific Gravity	Thermal Conductivity	CTE	Available Metal Thickness	Thickness Tolerance	Available Sizes
F4BTMS***-CU	Copper (Purple/Brass)	8.9	380 W/(M·K)	17 ppm/°C	0.48, 0.98, 1.48, 1.98, 2.98, 3.98mm (other thicknesses available upon request)	+0.02, -0.05	460×610mm, 460×305mm
F4BTMS***-AL	Aluminum	2.7	180 W/(M·K)	24 ppm/°C	0.48, 0.98, 1.48, 1.98, 2.98, 3.98mm (other thicknesses available upon request)	+0.02, -0.05	460×610mm, 460×305mm

Example: F4BTMS300-AL represents F4BTMS300 with aluminum base. F4BTMS300-CU represents F4BTMS300 with copper base.

15. Data Source Notes

• Dielectric Constant (Typical) is tested in the Z-direction of the material using GB/T 12636-1990 or IPC-TM-650 2.5.5.5 Stripline method.

• Dielectric Constant (Design) is tested using the 50Ω Microstrip Line method, also in the Z-direction.

• Other properties are tested using or referencing IPC-TM-650 or GBT4722-2017 standard test methods.

• All test data are typical measurement values intended to assist customers in material selection. They do not constitute any express or implied warranty and do not guarantee performance in specific applications. Customers are responsible for verifying the suitability of Wangling materials for each application.