* PCBs are custom-made, picture & parameters for reference
(Note: PCBs are custom-made products; the images and specifications provided are for reference only.)
Introduction to RT/Duroid 5880
Today, we are pleased to introduce our high-frequency PCBs constructed from RT/Duroid 5880 laminates. This advanced material from Rogers is a glass microfiber reinforced PTFE composite, specifically designed for demanding stripline and microstrip circuit applications.

Why Choose RT/Duroid 5880?
RT/Duroid 5880 offers exceptional dielectric constant uniformity, consistent performance across different panels, low dissipation factor extending into Ku-band and beyond, and is specifically engineered for microstrip and stripline applications.
| PCB Capability (RT/Duroid 5880) | |
|---|---|
| PCB Material: | Glass microfiber reinforced PTFE composites |
| Designation: | RT/duroid 5880 |
| Dielectric constant: | 2.20 ±0.02 (process), 2.20 (design) |
| Layer count: | 2 Layer, Multilayer, Hybrid type (Mixed) |
| Copper weight: | 0.5oz (17µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm), 31mil (0.787mm), 62mil (1.575mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, etc. |
RT/Duroid 5880 can be fabricated into double-sided boards, multilayer boards, and hybrid types, available in thicknesses of 10mil, 20mil, 31mil, and 62mil.
Typical Applications
1. Microstrip and stripline circuits
2. Broadband antennas for commercial airlines
3. Radar systems
4. Millimeter-wave applications
5. Point-to-point digital radio antennas


Additional Properties
The standard color of RT/Duroid 5880 PCBs is black. This material also offers low water absorption and excellent chemical resistance, making it ideal for various environments. If you have any questions or need further information, please feel free to contact us. Thank you for reading!
Appendix: Typical Values of Rogers 5880
| Property | RT/duroid 5880 | Units | Condition | Test Method |
|---|---|---|---|---|
| Electrical Properties | ||||
| Dielectric Constant, εr Process | 2.20 ±0.02 | - | 10 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Dielectric Constant, εr Design | 2.20 | - | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor, tanδ | 0.0009 | - | 10 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of εr | -125 | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2 x 10⁷ | Mohm·cm | C/96/35/90 | ASTM D257 |
| Surface Resistivity | 3 x 10⁷ | Mohm | C/96/35/90 | ASTM D257 |
| Thermal Properties | ||||
| Td | 500 | °C TGA | - | ASTM D3850 |
| Thermal Conductivity | 0.2 | W/m/k | 80°C | ASTM C518 |
| CTE - x | 31 | ppm/°C | 0-100°C | IPC-TM-650 2.4.41 |
| CTE - y | 48 | ppm/°C | 0-100°C | IPC-TM-650 2.4.41 |
| CTE - z | 237 | ppm/°C | 0-100°C | IPC-TM-650 2.4.41 |
| Mechanical Properties | ||||
| Tensile Modulus (X) | 1070 (156) | MPa (kpsi) | 23°C | ASTM D638 |
| Tensile Modulus (Y) | 860 (125) | MPa (kpsi) | 23°C | ASTM D638 |
| Copper Peel Strength | 31.2 (5.5) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 |
| Physical Properties | ||||
| Moisture Absorption | 0.02 | % | D48/50 | ASTM D570 |
| Density | 2.2 | gm/cm³ | - | ASTM D792 |
| Flammability | V-0 | - | - | UL 94 |
| Lead-free Process Compatible | Yes | - | - | - |
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