* PCBs are custom-made, picture & parameters for reference
(Note: Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)
Overview
Rogers RT/Duroid 5880 is a premium-quality printed circuit board (PCB) designed specifically for high-frequency applications, ideal for commercial airline broadband antennas.
Material Composition
The Rogers RT/Duroid 5880 is composed of glass microfiber-reinforced PTFE composites, expertly engineered for demanding microstrip and stripline circuit applications. Its remarkable dielectric constant uniformity is achieved through the use of randomly oriented microfibers. This ensures that the dielectric constant remains consistent across different panels and stable over a broad frequency range. Additionally, the low dissipation factor of RT/Duroid 5880 makes it suitable for use in Ku-band frequencies and beyond.
Key Features
Typical Applications
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PCB Specifications
Rogers RT/Duroid 5880 62mil 1.575mm High Frequency PCB for Commercial Airline Broadband Antennas |
|
PCB SIZE |
135 x 95mm = 1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 35µm(1 oz)+plate TOP layer |
RT/duroid 5880 1.575mm |
|
copper ------- 35µm(1oz)+plate BOT Layer |
|
Minimum Trace and Space: |
8 mil / 7 mil |
Minimum / Maximum Holes: |
0.4 mm / 4.5 mm |
Number of Different Holes: |
4 |
Number of Drill Holes: |
87 |
BOARD MATERIAL |
|
Glass Epoxy: |
RT/duroid 5880 1.575mm |
Final foil external: |
1.0 oz |
Final height of PCB: |
1.6 mm ±0.16 |
PLATING AND COATING |
|
Surface Finish |
Immersion gold |
VIA |
Plated through hole(PTH), minimum size 0.4mm. |
TEST |
100% Electrical Test prior shipment |
SERVICE AREA |
Worldwide, Globally. |
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Data Sheet for Rogers RT/Duroid 5880
RT/duroid 5880 Typical Value |
||||||
Property |
RT/duroid 5880 |
Direction |
Units |
Condition |
Test Method |
|
Dielectric Constant, εProcess |
2.20 |
Z |
N/A |
C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 |
|
Dielectric Constant, εDesign |
2.2 |
Z |
N/A |
8GHz to 40 GHz |
Differential Phase Length Method |
|
Dissipation Factor, tanδ |
0.0004 |
Z |
N/A |
C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 |
|
Thermal Coefficient of ε |
-125 |
Z |
ppm/℃ |
-50℃ to 150℃ |
IPC-TM-650 2.5.5.5 |
|
CTE (x) |
31 |
X |
ppm/℃ |
0-100℃ |
IPC-TM-650 2.4.41 |
|
CTE (y) |
48 |
Y |
ppm/℃ |
0-100℃ |
IPC-TM-650 2.4.41 |
|
CTE (z) |
237 |
Z |
ppm/℃ |
0-100℃ |
IPC-TM-650 2.4.41 |
|
Copper Peel Strength |
31.2(5.5) |
N/A |
pli(N/mm) |
1oz(35mm)EDC foil after solder float |
IPC-TM-650 2.4.8 |
|
Flammability |
V-0 |
N/A |
N/A |
N/A |
UL 94 |
|
Lead-free Process Compatible |
Yes |
N/A |
N/A |
N/A |
N/A |
|
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