RO3003G2 High-Frequency PCB with 10mil Substrate for Superior Performance
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
The RO3003G2 high-frequency PCB features a 2-layer rigid design with a stackup consisting of a 10mil (0.254mm) thick RO3003G2 dielectric material, complemented by a finished copper weight of 35μm on both sides.
The PCB measures 170mm x 90mm, maintaining precise dimensions with a tolerance of +/- 0.15mm. The minimum trace width and spacing are 4 mils (0.1mm), and the overall thickness of the finished board is 0.3mm. The via plating thickness is 20μm, and the surface finish is immersion gold. The top silkscreen is printed in white, while there is no silkscreen on the bottom side. The top solder mask is green, with no solder mask applied to the bottom side.
This PCB includes 25 components and a total of 93 pads, consisting of 62 through-hole pads and 31 surface-mount technology (SMT) pads located on the top side. The bottom side does not have any SMT pads. Additionally, there are 98 vias and 6 nets (connections) on the PCB. Each unit undergoes a comprehensive 100% electrical test to ensure full functionality before shipment.
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PCB Specifications
| PCB SIZE | 170 x 90mm=1up |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
| RO3003G2 0.254mm | |
| copper ------- 18um(0.5oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 4 mil |
| Minimum / Maximum Holes: | 0.3 mm / 1.5 mm |
| Number of Different Holes: | 12 |
| Number of Drill Holes: | 62 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Ceramic-filled PTFE | RO3003G2 |
| Final foil external: | 1.0 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.3 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold, 36% |
| Solder Mask Apply To: | Top Side |
| Solder Mask Color: | Green |
| Solder Mask Type: | Photo-Sensitive-Solder Mask |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | Top Side |
| Colour of Component Legend | White |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 0.3mm. |
| FLAMIBILITY RATING | 94 V0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Typical Applications
1.Adaptive cruise control
2.Forward collision warning
3.Active brake assist
4.Lane change assist
5.Traffic jam pilot
6.Parking pilot
7.Blind spot detection
Available RF PCB Materials
Rogers Materials: RO4350B, RO4003C, RO4725JXR, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4830, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210.
RT/Duroid Materials: RT/Duroid 5880, RT/Duroid 5870, RT/Duroid 6002, RT/Duroid 6006, RT/Duroid 6010.2LM, RT/Duroid 6035HTC, RT/Duroid 5880LZ, RT/Duroid 6202.
TMM Materials: TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438.
AD Series: AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000.
DiClad Materials: DiClad 880, DiClad 870, DiClad 527.
IsoClad Materials: IsoClad 917, IsoClad 933.
CLTE Materials: CLTE-XT, CLTE-AT, CLTE-MW.
Copper Clad Materials: CuClad 217, CuClad 233, CuClad 250.
Our PCB Services
PCB
Mass volume production
Single-sided PCB
Double-sided PCB
Multilayer PCB (up to 32 layers)
Heavy copper PCB
Hybrid PCB
Impedance-controlled PCB
Via-in-pad PCB
Ball grid array (BGA) PCB
Blind via PCB
Resin-filled via
Copper-filled via
Edge plated boards
Countersink holes, half holes, press-fit holes
Quick turnaround (QTA) delivery
No Minimum Order Quantity (MOQ)
Door-to-door shipment service
Capability:Producing 2500-3000 types each month.
Service Area
Serving regions including North America, Oceania, Southeast Asia, Eastern Europe, Africa, Latin America, Western & Southern Europe, Northern Europe, Central & South Asia, and the Middle East.
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