Rogers 3203 PCB RO3203 High Frequency PCB Double Sided RF Circuit Board For Base Station Infrastructure

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Product Description

The RO3203 High Frequency Circuit Materials from Rogers Corporation are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered for exceptional electrical performance and mechanical stability while maintaining competitive pricing. Key properties include:

*Dielectric Constant (DK): 3.02
*Dissipation Factor (DF): 0.0016
*Frequency Range: Effective beyond 40 GHz

RO3203 laminates combine the smooth surface of non-woven PTFE laminates, allowing for finer line etching tolerances, with the rigidity of woven-glass PTFE laminates. They can be fabricated into printed circuit boards using standard PTFE processing techniques. Available cladding options include 0.5, 1, or 2 oz./ft² (17, 35, 70 microns thick) of electrodeposited copper foil. All laminates are manufactured under an ISO 9002 certified quality system.

Features

1.Woven Glass Reinforcement: Enhances rigidity for easier handling.
2.Uniform Electrical and Mechanical Performance: Ideal for complex multilayer high-frequency structures.
3.Low Dielectric Loss: Suitable for high-frequency applications exceeding 20 GHz.
4.Excellent Mechanical Properties: Compatible with a wide range of dielectric constants, making it ideal for multilayer board designs.
5.Low In-Plane Expansion Coefficient: Matches copper, suitable for use with epoxy glass multilayer board hybrid designs and reliable surface-mounted assemblies.
6.Dimensional Stability: Provides excellent stability for high production yields.
7.Economically Priced: Cost-effective for volume manufacturing.
8.Surface Smoothness: Facilitates finer line etching tolerances.

RO3203 combines the surface smoothness of non-woven PTFE laminates for fine line etching tolerances with the rigidity of woven-glass PTFE laminates. These materials can be processed using standard PTFE circuit board manufacturing techniques. Available copper cladding options include 0.5, 1, or 2 oz./ft² (17, 35, 70 microns thick) of electrodeposited copper foil. The manufacturing process is compliant with ISO 9002 quality standards.

Typical Applications

1.Automotive Collision Avoidance Systems
2.Automotive Global Positioning Satellite Antennas
3.Base Station Infrastructure
4.Datalink on Cable Systems
5.Direct Broadcast Satellites
6.LMDS and Wireless Broadband
7.Microstrip Patch AntennasB
8.Power Backplanes
9.Remote Meter Readers
10.Wireless Telecommunications Systems

PCB Capability (RO3203)

PCB Capability (RO3203)
PCB Material:	Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation:	RO3203
Dielectric constant:	3.02±0.04
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP etc..

Data Sheet of RO3203