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* PCBs are custom-made, picture & parameters for reference
Rogers TMM10i Microwave Printed Circuit Board 75mil 1.905mm RF PCB With Pure Gold Plated
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
This type of Microwave PCB is built on a 75 mil TMM10i substrate with 1 oz copper (finished). It is a double-layer board without solder mask and silkscreen. The surface finish on pads is pure gold plated with 80 micro inches, with no nickel under gold. The boards are manufactured according to IPC Class II standards, with every 25 boards packed for shipment.
PCB Capabilities
| PCB SIZE | 75 x 68mm = 1up |
|---|---|
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper - 17um(0.5 oz)+plate TOP layer |
| TMM10i 1.905mm | |
| copper - 17um(0.5 oz)+plate BOT Layer | |
| Minimum Trace and Space: | 10 mil / 10 mil |
| Minimum / Maximum Holes: | 0.45 mm / 3.50 mm |
| Number of Drill Holes: | 3 |
| Surface Finish | Pure Gold-Plated (No nickel under gold), 52% |
| Final height of PCB: | 2.0 mm ±0.1 |
| TEST | 100% Electrical Test prior shipment |
| SERVICE AREA | Worldwide, Globally |
Typical Applications
1. Chip Testers
2. Dielectric Polarizers and Lenses
3. Filters and Couplers
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power Amplifiers and Combiners
7. RF and Microwave Circuitry
8. Satellite Communication Systems
Our PCB Capability (TMM10i)
| PCB Capability (TMM10i) | |
|---|---|
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM10i |
| Dielectric constant: | 9.80 ± 0.245 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz, 1oz, 2oz |
| PCB thickness: | 15mil~500mil |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, OSP, Pure Gold Plated (No Nickel under gold) etc. |
Data Sheet of (TMM10i)
| Property | TMM10i | Direction | Units | Condition | Test Method | |
|---|---|---|---|---|---|---|
| Dielectric Constant, ε Process | 9.80±0.245 | Z | -- | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Dielectric Constant, ε Design | 9.9 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor (process) | 0.002 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -43 | - | ppm/K | -55°C-125°C | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 10⁸ | - | Mohm.cm | - | ASTM D257 | |
| Surface Resistivity | 4 x 10⁷ | - | Mohm | - | ASTM D257 | |
| CTE - X | 19 | X | ppm/K | 0 to 140°C | ASTM E 831 | |
| CTE - Y | 19 | Y | ppm/K | 0 to 140°C | ASTM E 831 | |
| CTE - Z | 20 | Z | ppm/K | 0 to 140°C | ASTM E 831 | |
| Thermal Conductivity | 0.76 | Z | W/m/K | 80°C | ASTM C518 | |
| Moisture Absorption | 0.16-0.13 | - | % | D/24/23 | ASTM D570 | |
| Specific Gravity | 2.77 | - | - | A | ASTM D792 | |
| Specific Heat Capacity | 0.72 | - | J/g/K | A | Calculated | |
| Flammability | V-0 | - | - | - | UL 94 | |
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