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* PCBs are custom-made, picture & parameters for reference
Rogers TMM13i High-Frequency PCB, 60mil 1.524mm, Higher DK12.85 RF PCB with Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
In the fast-paced world of electronics, high-frequency PCBs are essential for enabling advanced technologies. The Rogers TMM13i High-Frequency PCB, with a thickness of 60mil (1.524mm) and a high dielectric constant (DK) of 12.85, is a top choice for engineers and designers working on RF and microwave applications. This double-sided PCB, featuring immersion gold surface finish and a green solder mask, is designed to deliver exceptional performance in demanding environments.
Key Features of Rogers TMM13i PCB
1. High Dielectric Constant (DK12.85): The TMM13i material is optimized for high-frequency applications, ensuring minimal signal loss and superior performance in RF and microwave circuits. Its high DK makes it ideal for compact designs where space is at a premium.
2. Low Dissipation Factor: The TMM13i PCB ensures efficient signal transmission, making it suitable for applications that require high signal integrity, such as 5G and satellite communications.
3. Immersion Gold Surface Finish: The immersion gold finish provides excellent conductivity, corrosion resistance, and solderability, ensuring long-term reliability in harsh environments.
4. Customizable Copper Weight: The PCB features a transition from 0.5 oz to 1 oz copper, offering flexibility in design and application.
5. Green Solder Mask: The green solder mask on the top side enhances the board's durability and aesthetic appeal.
6. IPC Class 2 Standards: Manufactured according to IPC Class 2 standards, the TMM13i PCB ensures high quality and reliability.
Applications
The Rogers TMM13i PCB is well-suited for a variety of high-frequency and high-power applications, including:
1. RF and Microwave Circuitry: Ideal for high-frequency signal transmission with minimal loss.
2. Satellite Communication Systems: Ensures reliable performance in space and terrestrial communication systems.
3. Global Positioning Systems (GPS) Antennas: Provides stable signal integrity for navigation and tracking systems.
4. Patch Antennas: Suitable for compact and high-performance antenna designs.
5. Power Amplifiers and Combiners: Delivers efficient power handling and signal integrity.
6. Filters and Couplers: Ensures precise signal filtering and coupling in RF systems.
7. Dielectric Polarizers and Lenses: Used in advanced optical and RF applications.
8. Chip Testers: Provides reliable performance for testing high-frequency components.
PCB Specifications
| PCB SIZE | 100 x 100mm = 1up |
|---|---|
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper - 17um(0.5 oz)+plate TOP layer |
| TMM13i 1.524mm | |
| copper - 17um(0.5 oz)+plate BOT Layer | |
| Minimum Trace and Space: | 4 mil / 5 mil |
| Minimum / Maximum Holes: | 0.35 mm / 2.0 mm |
| Number of Drill Holes: | 1525 |
| Surface Finish | Immersion gold, 67% |
| Solder Mask Color: | Green |
| Final height of PCB: | 1.6mm ±0.1 |
| TEST | 100% Electrical Test prior shipment |
| SERVICE AREA | Worldwide, Globally |
Our PCB Capability (TMM13i)
| PCB Capability (TMM13i) | |
|---|---|
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM13i |
| Dielectric constant: | 12.85±0.35 |
| Layer count: | Single Layer, Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 1oz, 2oz |
| Dielectric thickness: | 15mil~500mil |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, ENEPIG, Pure gold etc. |
Data Sheet of TMM13i
| Property | TMM13i | Direction | Units | Condition | Test Method | |
|---|---|---|---|---|---|---|
| Dielectric Constant, ε Process | 12.85±0.35 | Z | -- | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Dielectric Constant, ε Design | 12.2 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor (process) | 0.0019 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -70 | - | ppm/K | -55°C-125°C | IPC-TM-650 2.5.5.5 | |
| CTE - X | 19 | X | ppm/K | 0 to 140°C | ASTM E 831 | |
| CTE - Y | 19 | Y | ppm/K | 0 to 140°C | ASTM E 831 | |
| CTE - Z | 20 | Z | ppm/K | 0 to 140°C | ASTM E 831 | |
| Moisture Absorption | 0.16-0.13 | - | % | D/24/23 | ASTM D570 | |
| Specific Gravity | 3 | - | - | A | ASTM D792 | |
| Flammability | V-0 | - | - | - | UL 94 | |
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