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Rogers RO3035 High Frequency PCB 2-Layer Rogers 3035 10mil Circuit Board DK3.5 DF 0.0015 Microwave PCB

(Note: Printed Circuit Boards (PCBs) are custom-made products. The images and specifications provided are for reference only.)


Overview of Rogers RO3035 High Frequency Circuit Materials

The Rogers RO3035 high frequency PCB is crafted from ceramic-filled PTFE composites, specifically designed for commercial microwave and RF applications. This material delivers exceptional electrical and mechanical stability at competitive prices. Its consistent mechanical properties enable designers to create multi-layer board configurations without issues such as warpage or reliability concerns.


The RO3035 materials have a coefficient of thermal expansion (CTE) of 17 ppm/℃ in both the X and Y axes, which closely matches that of copper. This compatibility ensures excellent dimensional stability, with typical etch shrinkage post-processing of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, providing outstanding reliability for plated through-holes, even in demanding environments.


Typical Applications

  1. 1.Automotive radar systems
  2. 2.Cellular telecommunications networks
  3. 3.Datalink over cable systems
  4. 4.Direct broadcast satellite technology
  5. 5.Global Positioning System (GPS) antennas
  6. 6.Patch antennas for wireless communication
  7. 7.Power amplifiers and antennas
  8. 8.Power backplanes
  9. 9.Remote meter reading devices


PCB Specifications

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Rogers RO3035 10mil 0.254mm High Frequency PCB DK3.5 RF PCB for Patch Antenna for Wireless Communications

PCB SIZE

55 x 57mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 18um(0.5 oz)+plate TOP layer

RO3035 0.254mm

copper ------- 18um(0.5 oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

4 mil / 4 mil

Minimum / Maximum Holes:

0.4 mm / 5.5 mm

Number of Different Holes:

5

Number of Drill Holes:

79

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RO3035 0.254mm

Final foil external:

1 oz

Final foil internal:

N/A

Final height of PCB:

0.3 mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion gold

Solder Mask Apply To:

N/A

Solder Mask Color:

N/A

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

N/A

Colour of Component Legend

N/A

Manufacturer Name or Logo:

N/A

VIA

Plated through hole(PTH), minimum size 0.4mm.

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.



PCB Capability (RO3035)

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PCB Material:

Ceramic-filled PTFE Composites

Designation:

RO3035

Dielectric constant:

3.5

Dissipation Factor

0.0015 10GHz

Layer count:

Single Sided PCB, Double Sided PCB, Multilayer PCB, Hybrid PCB

Copper weight:

1oz (35µm), 2oz (70µm)

Laminate thickness:

5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm  )

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold plated etc..


Data Sheet for Rogers 3035 (RO3035)

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RO3035 Typical Value

Property

RO3035

Direction

Units

Condition

Test Method

Electrical Properties

 

 

 

 

 

Dielectric Constant,εProcess

3.50±0.05

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

3.6

Z

 

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0015

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

-45

Z

ppm/℃

10 GHz -50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

107

 

MΩ.cm

COND A

IPC 2.5.17.1

Surface Resistivity

107

 

MΩ

COND A

IPC 2.5.17.1

Thermal Properties

 

 

 

 

 

Td

500

 

℃ TGA

 

ASTM D 3850

Coefficient of Thermal Expansion
(-55 to 288℃)

17
17
24

X
Y
Z

ppm/℃

23℃/50% RH

IPC-TM-650 2.4.4.1

Thermal Conductivity

0.5

 

W/M/K

50℃

ASTM D 5470

Mechanical Properties

 

 

 

 

 

Copper Peel Stength

10.2

 

Ib/in.

1oz,EDC After Solder Float

IPC-TM 2.4.8

Young's Modulus

1025
1006

 

MPa

23℃

ASTM D 638

Dimensional Stability (MD, CMD)

-0.11          0.11

 

mm/m

Condition A

IPC TM-650 2.2.4

Physical Properties

 

 

 

 

 

Flammability

V-0

 

 

 

UL 94

Moisture Absorption

0.04

 

%

D48/50

IPC-TM-650 2.6.2.1

Density

2.1

 

gm/cm3

23℃

ASTM D 792

Lead-free Process Compatible

Yes

 

 

 



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