Rogers RO4360 High Frequency PCB Based on 6-layer with 8mil Core Coating Immersion Gold for Small Cell Transceivers

(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)

Overview:

RO4360G2 laminates from Rogers Corporation are high-performance materials with a dielectric constant (Dk) of 6.15 and low loss properties. These glass-reinforced, hydrocarbon ceramic-filled thermoset materials provide an ideal balance of performance and processing ease. RO4360G2 extends Rogers' portfolio by offering a lead-free process capable solution that enhances rigidity for improved manufacturability in multi-layer board constructions, while also reducing material and fabrication costs.

These laminates process similarly to FR-4 and are compatible with automated assembly. They feature a low Z-axis coefficient of thermal expansion (CTE) for design flexibility and share a high glass transition temperature (Tg) consistent with the entire RO4000 product line. RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminates in multi-layer designs.

With a Dk of 6.15 (Design Dk 6.4), RO4360G2 laminates allow designers to minimize circuit dimensions in applications where size and cost are critical. They are an excellent value choice for engineers working on designs such as power amplifiers, patch antennas, ground-based radar, and other general RF applications.

Features and Benefits

Thermoset Resin System
1.Specially formulated to meet 6.15 Dk
2.Ease of fabrication; processes similar to FR-4
3.Material repeatability
4.Low loss
5.High thermal conductivity
6.Lower total PCB cost compared to competing PTFE products

Low Z-axis CTE / High Tg
1.Design flexibility
2.Plated through-hole reliability
3.Compatible with automated assembly

Environmentally Friendly
1.Lead-free process compatible

Regional Finished Goods Inventory
1.Short lead times and quick inventory turns
2.Efficient supply chain management

Typical Applications

Base Station Power Amplifiers
Small Cell Transceivers
Patch Antennas
Ground-Based Radar

PCB Capability

PCB Capability (RO4360G2)
PCB Material:	Hydrocarbon Ceramic-filled Thermoset Materials
Designation:	RO4360G2
Dielectric constant:	6.15 ±0.15
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP etc..

Stack Up

Data Sheet of RO4360G2