RF-35TC High Frequency PCB Material for Thermal Management and RF Applications

August 3,2025

Introduction

Taconic RF-35TChigh frequency PCBs feature PTFE-based, ceramic-filled fiberglass laminates that deliver exceptional thermal management and stable electrical performance. These materials outperform hydrocarbon-based competitors with superior heat dissipation and resistance to oxidation or yellowing.

Key Features

Ultra-Low Signal Loss: Best-in-class 0.002 loss tangent at 10GHz
Advanced Thermal Management: 0.6W/m/k thermal conductivity (unclad)
Stable Electrical Properties: Consistent Dk across temperature variations
Enhanced Antenna Performance: Improves gain and efficiency
Reliable Construction: Excellent adhesion to VLP copper for durability

PCB Capabilities

Board Configurations: Single/double-layer, multilayer, and hybrid designs
Thickness Options: 5mil to 60mil standard thicknesses
Copper Weights: 1oz and 2oz finished copper
Panel Size: Up to 400mm × 500mm available
Customization: Multiple solder mask colors and surface finishes

Applications

RF filters and couplers
High-power amplifiers
Antenna systems
Satellite components
Thermal-sensitive RF devices

Call to Action

Upgrade your high-power RF designs with RF-35TC's thermal management advantages - contact us for your high-frequency PCB requirements.