TC350 High-Frequency PCB - Superior Thermal Management for RF Power Applications

July 11, 2025

1.Introduction to TC350 Material

Rogers TC350 high frequency PCBs combine PTFE, thermally conductive ceramic fillers, and woven glass reinforcement to deliver superior thermal management and electrical performance. These laminates effectively reduce hot spots, improve heat dissipation, and enhance reliability in high-power RF applications.

2.Key Features and Benefits (H2)

Optimized Thermal Conductivity: 0.72W/m-K for effective heat dissipation
Stable Dielectric Properties: Dk of 3.5 with low thermal coefficient (-9 ppm/°C)
Minimal Signal Loss: 0.002 loss tangent at 10GHz for improved efficiency
Excellent Dimensional Stability: Low CTE (X/Y:7ppm/°C, Z:23ppm/°C)
Enhanced Reliability: Reduces solder fatigue and extends component lifespan

3.PCB Capabilities

Board Types: Single/double-sided, multilayer, and hybrid configurations
Copper Options: 1oz (35µm) and 2oz (70µm) available
Thickness Range: 10mil to 125mil (0.254mm-3.175mm)
Panel Size: Up to 400mm × 500mm
Customization: Multiple solder mask colors and surface finishes (ENIG, HASL, immersion silver, etc.)

4. Applications

Power amplifiers and filters
RF couplers and combiners
Tower-mounted amplifiers (TMA/TMB)
Microwave power dividers
High-frequency communication systems

5.Call to Action

Maximize your RF system performance with TC350's thermal advantages - contact us for your high-power PCB solutions.