Home > Copper Clad Laminates > AGC TLX-7 DK2.60 Df0.0014 (0.089-6.35mm) PTFE/Woven Fiberglass Laminate

AGC TLX-7 PTFE/Woven Fiberglass Laminate
Material:AGC TLX-7 / PTFE + Woven Fiberglass
MOQ:1 Sheet
Price:179-689 USD/Sheet
Packaging:Anti-static / Protective Packaging
Delivery Period:5-10 working days
Payment Method:T/T, Paypal
 

AGC TLX-7 DK2.60 Df0.0014 (0.089-6.35mm) PTFE/Woven Fiberglass Laminate


Brief Introduction

TLX is a high-volume fiberglass-reinforced microwave substrate offering reliability in a wide range of RF applications. This versatile PTFE/fiberglass laminate features a dielectric constant range of 2.45-2.65 and is available in various thicknesses and copper claddings. TLX-7 has a dielectric constant of 2.60 ±0.04 and is suitable for low layer count microwave designs, particularly where mechanical reinforcement is required in severe environments.


Technical Features & Benefits

  • Excellent PIM values in PCBs (measured lower than -160 dBc*)
  • Excellent mechanical and thermal properties
  • Low and stable dielectric constant
  • Dimensionally stable
  • Low moisture absorption
  • Tightly controlled Dk (±0.04)
  • Low dissipation factor (Df 0.0014 @ 1.9GHz, 0.0020 @ 10GHz)
  • UL 94 V-0 flammability rating
  • For low layer count microwave designs
  • Long space heritage with NASA low outgassing compliance
  • ~ ±2% variation in Dk from -55°C to 125°C
  • Surface optimized for copper adhesion

AGC TLX-7 Laminate


Typical Properties: AGC TLX-7

Property Test Method Unit TLX-7 Unit TLX-7
Electrical Properties
Dk @ 10 GHzIPC-650 2.5.5.32.602.60
Df @ 1.9 GHzIPC-650 2.5.5.5.10.00140.0014
Df @ 10 GHzIPC-650 2.5.5.5.10.00200.0020
Outgassing (% TML)ASTM E 595%0.02
Outgassing (% CVCM)ASTM E 595%0.00
Outgassing (% WVR)ASTM E 595%0.01
Dielectric BreakdownIPC-650 2.5.6kV>45kV>45
Surface ResistivityIPC-650 2.5.17.1 Sec. 5.2.1 (Elevated Temp.)6.605 x 10⁸6.605 x 10⁸
Surface ResistivityIPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.)3.550 x 10⁶3.550 x 10⁶
Volume ResistivityIPC-650 2.5.17.1 Sec. 5.2.1 (Elevated Temp.)MΩ·cm1.110 x 10¹⁰MΩ·cm1.110 x 10¹⁰
Volume ResistivityIPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.)MΩ·cm1.046 x 10¹⁰MΩ·cm1.046 x 10¹⁰
Mechanical Properties
Flexural Strength (MD)ASTM D 790psi28,900N/mm²199
Flexural Strength (CD)ASTM D 790psi20,600N/mm²142
Tensile Strength (MD)ASTM D 902psi35,600N/mm²245
Tensile Strength (CD)ASTM D 902psi27,500N/mm²190
Elongation at Break (MD)ASTM D 902%3.94%3.94
Elongation at Break (CD)ASTM D 902%3.92%3.92
Young's Modulus (MD)ASTM D 902kpsi980N/mm²6757
Young's Modulus (CD)ASTM D 902kpsi1,200N/mm²8274
Young's Modulus (MD)ASTM D 3039kpsi1,630N/mm²11,238
Poisson's RatioASTM D 30390.1350.135
Peel Strength (1 oz. ED)IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress)lbs/in15N/mm2.63
Peel Strength (1 oz. RTF)IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress)lbs/in17N/mm2.98
Peel Strength (½ oz. ED)IPC-650 2.4.8.3 (Elevated Temp.)lbs/in14N/mm2.45
Peel Strength (½ oz. ED)IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress)lbs/in11N/mm1.93
Peel Strength (1 oz. rolled)IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress)lbs/in13N/mm2.28
Dimensional Stability (MD)IPC-650 2.4.39 Sec. 5.4 (After Bake)mils/in0.06mm/M0.06
Dimensional Stability (CD)IPC-650 2.4.39 Sec. 5.4 (After Bake)mils/in0.08mm/M0.08
Dimensional Stability (MD)IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)mils/in0.09mm/M0.09
Dimensional Stability (CD)IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)mils/in0.10mm/M0.10
Thermal Properties
Thermal ConductivityASTM F433/ASTM 1530-06W/m·K0.19W/m·K0.19
CTE (X axis) (25-260°C)IPC-650 2.4.41/ASTM D 3386ppm/°C21ppm/°C21
CTE (Y axis) (25-260°C)IPC-650 2.4.41/ASTM D 3386ppm/°C23ppm/°C23
CTE (Z axis) (25-260°C)IPC-650 2.4.41/ASTM D 3386ppm/°C215ppm/°C215
Td (2% Weight Loss)IPC-650 2.4.24.6 (TGA)°C535°C535
Td (5% Weight Loss)IPC-650 2.4.24.6 (TGA)°C553°C553
Physical Properties
Moisture AbsorptionIPC-650 2.6.2.1%0.02%0.02
Density (Specific Gravity)ASTM D 792g/cm³2.25g/cm³2.25
Flammability RatingUL 94V-0V-0

Application Areas

  • Antennas
  • Mixers, Splitters, Filters & Combiners
  • Passive Components
  • Radar systems
  • Mobile communications
  • Microwave test equipment
  • Microwave transmission devices
  • RF components
  • Applications requiring resistance to severe environments:
    • Space launch vibration resistance
    • High temperature exposure in engine modules
    • Radiation resistance in space
    • Extreme maritime environments for warship antennas
    • Wide temperature ranges for altimeter substrates during flight

Available Configurations

  • Dielectric Constant: 2.60 ± 0.04
  • Dielectric Thickness Range: 0.0035" - 0.250" (0.089 mm - 6.35 mm)
  • Copper Cladding: Can be combined with any of AGC's available copper claddings; surface optimized for copper adhesion
  • Part Number Example: TLX-7-0310-CH/CH - 18" x 24" (457 mm x 610 mm)
  • Available as very thin laminate for coupler-type applications

 


 

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