Home > Copper Clad Laminates > AGC TLX-8 DK2.55 Df0.0018 (0.064-6.35mm) PTFE/Woven Fiberglass Laminate

AGC TLX-8 Laminate
Material:AGC TLX-8 / PTFE/Woven Fiberglass
MOQ:1 Sheet
Price:219-849 USD/Sheet
Packaging:Anti-static / Protective Packaging
Delivery Period:7-13 working days
Payment Method:T/T, Paypal
 

AGC TLX-8 DK2.55 Df0.0018 (0.064-6.35mm) PTFE/Woven Fiberglass Laminate


Brief Introduction

TLX-8 is a high-volume fiberglass-reinforced microwave substrate offering reliability in a wide range of RF applications. This versatile PTFE/fiberglass laminate features a dielectric constant range of 2.45-2.65 and is available in various thicknesses and copper claddings. It is suitable for low layer count microwave designs and serves as a workhorse in the RF microwave substrate world, particularly where mechanical reinforcement is required in severe environments.


Technical Features & Benefits

Excellent PIM values in PCBs (measured lower than -160 dBc*)
Excellent mechanical and thermal properties
Low and stable dielectric constant
Dimensionally stable
Low moisture absorption
Tightly controlled Dk (±0.04)
Low dissipation factor (0.0018)
UL 94 V-0 flammability rating
For low layer count microwave designs
Long space heritage with NASA low outgassing compliance
~ ±2% variation in Dk from -55°C to 125°C


AGC TLX-8 Laminate


Typical Properties: TLX-8

Properties Conditions Typical Value Unit Test Method
Electrical Properties
Dielectric Constant@ 10 GHz2.55 ± 0.04IPC-650 2.5.5.3
Dissipation Factor@ 10 GHz0.0018IPC-650 2.5.5.5.1
Outgassing% TML0.034 H 257 °F @ ≤ 5 x 10⁻⁵ TorrASTM E 595
% CVCM0.00
% WVR0.01
Surface Resistivity6.605 x 10⁸IPC-650 2.5.17.1 Sec. 5.2.1 (Elevated Temp.)
3.550 x 10⁶IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.)
Volume Resistivity1.110 x 10¹⁰MΩ·cmIPC-650 2.5.17.1 Sec. 5.2.1 (Elevated Temp.)
1.046 x 10¹⁰MΩ·cmIPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.)
Dimensional StabilityMD0.06mm/m (mils/in)IPC-650 2.4.39 Sec. 5.4 (After Bake)
CD0.08mm/m (mils/in)
MD0.09mm/m (mils/in)IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)
CD0.10mm/m (mils/in)
Thermal Properties
Thermal Conductivity0.19W/m·KASTM F433/ASTM 1530-06
CTE (25-260°C)X21ppm/°CIPC-650 2.4.41/ASTM D 3386
Y23ppm/°C
Z215ppm/°C
Td2% Weight Loss535°CIPC-650 2.4.24.6 (TGA)
5% Weight Loss553°C
Mechanical Properties
Peel Strength1 oz. ED2.63 (15)N/mm (lbs/in)IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress)
1 oz. RTF2.98 (17)N/mm² (kpsi)
½ oz. ED2.45 (14)N/mm² (kpsi)IPC-650 2.4.8.3 (Elevated Temp.)
½ oz. ED1.93 (11)N/mm² (kpsi)IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress)
1 oz. rolled2.28 (13)N/mm² (kpsi)
Young's ModulusMD6,757 (980)N/mm² (psi)ASTM D 902
CD8,274 (1,200)N/mm² (psi)
MD11,238 (1,630)N/mm² (psi)ASTM D 3039
Chemical/Physical Properties
Moisture Absorption0.02%IPC-650 2.6.2.1
Dielectric Breakdown> 45kVIPC-650 2.5.6
Flammability RatingV-0UL-94

Application Areas

Antennas
Mixers, Splitters, Filters & Combiners
Passive Components
Radar systems
Mobile communications
Microwave test equipment
Microwave transmission devices
RF components
Applications requiring resistance to severe environments: space launch vibration, high temperature exposure, radiation resistance, extreme maritime conditions, wide temperature ranges during flight


Available Configurations

Dielectric Thickness Range: 0.0025" - 0.250" (0.064 mm - 6.35 mm); can be manufactured in increments of 0.005" (0.125 mm)

Standard Panel Size: 18" x 24" (457 mm x 610 mm)

Available Sheet Sizes:
12" x 18" (305 x 457 mm)
16" x 18" (406 x 457 mm)
18" x 24" (457 x 610 mm)
16" x 36" (406 x 914 mm)
24" x 36" (610 x 914 mm)
18" x 48" (457 x 1,220 mm)
36" x 48" (914 x 1,220 mm)

Copper Cladding: Various options available including ED, RTF, and rolled copper foils

Contact AGC for availability of additional thicknesses, other sizes, and other types of cladding


 

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