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CuClad 217 Low-DK PCB Laminate for RF Electronics

Brief Introduction

CuClad® 217 is a PTFE/woven fiberglass reinforced laminate designed for high-performance microwave printed circuit board applications. It offers true electrical and mechanical isotropy in the XY plane—a unique feature among fiberglass-reinforced PTFE laminates—making it ideal for phase-sensitive circuits such as phased array antennas.


Technical Features & Benefits

Ultra-Low Dielectric Constant: Dk = 2.17 (also available as 2.20) at 10 GHz, enabling faster signal propagation and improved signal-to-noise ratio.
Extremely Low Loss: Dissipation factor of 0.0009 at 10 GHz, suitable for high-frequency, low-loss designs.
True XY Isotropy: Cross-plied woven fiberglass ensures uniform electrical and mechanical properties in the plane of the board.
Excellent Thermal Stability: Low thermal coefficient of Dk (–160 ppm/°C) and low CTE for reliable performance across temperature ranges.
High Electrical Insulation: Volume resistivity up to 2.3×10⁸ MΩ·cm, ensuring superior isolation in RF circuits.



Typical Properties

Click to expand/collapse the table
Property Test Method Condition CuClad 217
Dielectric Constant @10 GHz IPC TM-650 2.5.5.5 C23/50 2.17, 2.20
Dielectric Constant @1 MHz IPC TM-650 2.5.5.3 C23/50 2.17, 2.20
Dissipation Factor @10 GHz IPC TM-650 2.5.5.5 C23/50 0.0009
Thermal Coefficient of Er IPC TM-650 2.5.5.5 Adapted –10°C to +140°C –160 ppm/°C
Peel Strength (lbs/in) IPC TM-650 2.4.8 After Thermal Stress 14
Volume Resistivity (MΩ·cm) IPC TM-650 2.5.17.1 C96/35/90 2.3×10⁸
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 3.4×10⁶
Arc Resistance (seconds) ASTM D-495 D48/50 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23°C 275, 219
Tensile Strength (kpsi) ASTM D-882 A, 23°C 8.8, 6.6
Compressive Modulus (kpsi) ASTM D-695 A, 23°C 237
Flexural Modulus (kpsi) ASTM D-790 A, 23°C 357
Dielectric Breakdown (kV) ASTM D-149 D48/50 >45
Specific Gravity (g/cm³) ASTM D-792 Method A A, 23°C 2.23
Water Absorption (%) MIL-S-13949H 3.7.7 / IPC TM-650 2.6.2.2 E1/105 + D24/23 0.02
CTE (ppm/°C) – X Axis IPC TM-650 2.4.24 (Mettler 3000 TMA) 0°C to 100°C 29
CTE (ppm/°C) – Y Axis IPC TM-650 2.4.24 (Mettler 3000 TMA) 0°C to 100°C 28
CTE (ppm/°C) – Z Axis IPC TM-650 2.4.24 (Mettler 3000 TMA) 0°C to 100°C 246
Thermal Conductivity (W/m·K) ASTM E-1225 100°C 0.26
Outgassing – TML (%) NASA SP-R-0022A 125°C, ≤10⁻⁶ torr 0.01
Outgassing – CVCM (%) NASA SP-R-0022A 125°C, ≤10⁻⁶ torr 0.01
Outgassing – WVR (%) NASA SP-R-0022A 125°C, ≤10⁻⁶ torr 0.00
Visible Condensate NASA SP-R-0022A 125°C, ≤10⁻⁶ torr NO
Flammability UL 94 Vertical Burn / IPC TM-650 2.3.10 C48/23/50, E24/125 Meets UL94-V0

Application Areas

Military & Defense Electronics: Radars, ECM (Electronic Countermeasures), ESM (Electronic Support Measures).
Microwave Components: Low-Noise Amplifiers (LNAs), filters, couplers, power dividers.
Phased Array Antennas: Where XY isotropy and stable Dk are critical.
Aerospace & Satellite Systems: High-frequency communication payloads.
Test & Measurement: Calibration substrates and RF probe cards.


Available Configurations:

Copper Cladding: ½ oz, 1 oz, or 2 oz electrodeposited copper on both sides; rolled copper also available.
Panel Sizes: 36" × 36" (cross-plied) or 36" × 48" (parallel-plied).
Metal-Backed Options: Bonded to aluminum, brass, or copper plates for heat sinking and mechanical support.
Testing Grade: "LX" grade available with individual sheet testing and certification.


Why Choose Us?

1. Engineering design prevents problems from occurring in pre-production;
2. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
3. AOI inspection;
4. Delivery on time higher than 98% on-time-delivery rate;
5. 16000m2 workshop;
6. 30000m2 output capability per month;
7. 8000 types of PCB's per month;
8. Quick CADCAM checking and free PCB quotation;
9. More than 18+ years of PCB experience;
10. Customer complaint rate: <1%