Copper Clad Laminates
Welcome to our "Copper Clad Laminates" column, your entry point into the essential foundation of printed circuit board manufacturing—where material science meets electrical engineering to enable reliable and high-performance electronics. In this column, we explore the core role of copper clad laminates (CCL), the critical base material that supports, insulates, and interconnects electronic circuits in virtually every modern device.
Copper Clad Laminates represent the backbone of PCB construction, combining mechanical stability with electrical precision through the bonding of conductive copper foil to a dielectric substrate. By selecting from a variety of resin systems, reinforcement materials, and copper types, these laminates provide tailored solutions that meet diverse requirements for thermal management, signal integrity, frequency performance, and environmental durability. Through continuous innovation in materials and processing, copper clad laminates empower the development of more advanced, efficient, and dependable electronic products.
AL₂O₃ Ceramic PCB: High-Performance Double-Sided Substrates for IGBT Heat Dissipation
The AL₂O₃ (96%) Ceramic PCB is designed for superior thermal conductivity and reliability in high-power applications. Built on double-sided 1.0mm substrates with 1oz copper and immersion gold plating, this custom-manufactured PCB supports efficient heat dissipation for electronic devices.
Tags: PCB, ceramic PCB, AL₂O₃ PCB, double-sided PCB, high-performance PCB, thermal conductivity PCB, immersion gold PCB, RF PCB, power electronics PCB, custom PCB manufacturing
AlN Ceramic PCB High-Performance 1.5mm Thickness for Efficient Signal Transmission
The AlN ceramic PCB is a high-performance solution designed for efficient signal transmission and superior thermal management. With a robust 1.5mm thickness and advanced aluminum nitride substrate, this PCB is ideal for high-frequency and high-power applications.
Tags: AlN ceramic PCB, aluminum nitride PCB, high-performance PCB, thermal management PCB, immersion gold PCB, electrical insulation PCB, high-frequency PCB
Si3N4 Ceramic PCB High-Performance 96% Substrate with 80 W/MK Thermal Conductivity
The Si3N4 ceramic PCB is a high-performance solution designed for efficient heat dissipation and reliable connections. With advanced features and customizable options, this PCB is ideal for demanding applications in high-power electronics.
Tags: Si3N4 ceramic PCB, silicon nitride PCB, high-performance PCB, thermal conductivity PCB, gold plated PCB, active metal brazing PCB, custom PCB