Rogers Rt/Duroid 5880lz: High-Performance PCB Material for RF Electronics
Brief Introduction
RT/duroid 5880LZ is a filled PTFE composite laminate engineered for demanding stripline and microstrip circuit applications in high-frequency electronics. It provides a low-density, lightweight solution suitable for performance-critical and weight-sensitive designs, such as aerospace and advanced communication systems.
Technical Features & Benefits
Low and Stable Dielectric Constant: The dielectric constant (εr) remains consistently low at 2.00 across panels and over a wide frequency range, ensuring reliable signal integrity in RF and microwave circuits.
Low Dissipation Factor: With a typical loss tangent of 0.0021, the material supports low-loss performance up to Ku-band and beyond, ideal for high-frequency printed circuit boards.
Excellent Thermal and Dimensional Stability: Low thermal coefficient of εr (+20 ppm/°C) and minimal dimensional change (-0.38%) ensure reliable operation under varying environmental conditions.
Superior Electrical Properties: High volume and surface resistivity, along with strong dielectric strength (40 kV), provide robust insulation and performance in multilayer PCB designs.
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Typical Properties:RT/duroid 5880LZ
| Property | Typical Value [1] | Direction | Units | Condition | Test Method |
|---|---|---|---|---|---|
| Dielectric Constant, εr (Process) | 2.00 ± 0.04 | Z | 10 GHz / 23°C | IPC-TM-650, 2.5.5.5 | |
| Dielectric Constant, εr (Design) | 2.00 | Z | 8 GHz - 40 GHz | Differential Phase Length | |
| Dissipation Factor, tan δ | Typ: 0.0021 Max: 0.0027 | Z | 10 GHz / 23°C | IPC-TM-650, 2.5.5.5 | |
| Thermal Coefficient of εr | +20 | Z | ppm/°C | -50°C to 150°C, 10 GHz | IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 1.74 × 107 | MΩ·cm | C-96/35/90 | IPC-TM-650, 2.5.17.1 | |
| Surface Resistivity | 2.08 × 106 | MΩ | C-96/35/90 | IPC-TM-650, 2.5.17.1 | |
| Electrical Strength | 40 | kV | D48/50 | IPC-TM-650, 2.5.6 | |
| Dimensional Stability | -0.38 | X,Y | % | IPC-TM-650, 2.4.39A | |
| Moisture Absorption | 0.31 | % | 24 hr / 23°C | IPC-TM-650, 2.6.2.1 | |
| Thermal Conductivity | 0.33 | Z | W/m·K | 80°C | ASTM C518 |
| Coefficient of Thermal Expansion | 54, 47 (X,Y) 40 (Z) | X,Y / Z | ppm/°C | 0 to 150°C | IPC-TM-650, 2.4.41 |
| Outgassing - TML | 0.01 | % | ASTM E-595 | ||
| Outgassing - CVCM | 0.01 | % | ASTM E-595 | ||
| Outgassing - WVR | 0.01 | % | ASTM E-595 | ||
| Density | 1.4 | g/cm³ | ASTM D792 | ||
| Copper Peel Strength | >4.0 | pli | IPC-TM-650, 2.4.8 | ||
| Flammability Rating | V-0 | UL 94 | |||
| Lead-Free Process Compatible | YES |
Avaliable Configurations
| tandard Thicknesses | Standard Panel Sizes | Standard Claddings |
|---|---|---|
| 0.010" ±0.0007" | 12" × 18" (305 × 457 mm) | ½ oz ED Copper (HH/HH) |
| 0.020" ±0.0015" | 24" × 18" (610 × 457 mm) | 1 oz ED Copper (H1/H1) |
| 0.050" ±0.0015" | Additional sizes available | Other cladding weights available |
Why Choose Us?
1. Engineering design prevents problems from occurring in pre-production;
2. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
3. AOI inspection;
4. Delivery on time higher than 98% on-time-delivery rate;
5. 16000m2 workshop;
6. 30000m2 output capability per month;
7. 8000 types of PCB's per month;
8. Quick CADCAM checking and free PCB quotation;
9. More than 18+ years of PCB experience;
10. Customer complaint rate: <1%
