Home > Copper Clad Laminates > Wangling F4BME255 DK2.55 Df0.0013 PIM ≤-159dBc (0.1-12.0mm) RTF Copper Clad Laminate

Wangling F4BME255 RTF Copper Clad Laminate
Material:Wangling F4BME255 / PTFE + Fiberglass with RTF Copper
MOQ:1 Sheet
Price:209-799 USD/Sheet
Packaging:Anti-static / Protective Packaging
Delivery Period:6-12 working days
Payment Method:T/T, Paypal
 

Wangling F4BME255 DK2.55 Df0.0013 PIM ≤-159dBc (0.1-12.0mm) RTF Copper Clad Laminate


Brief Introduction

Wangling F4BME series are PTFE glass fabric copper-clad laminates that share the same dielectric layer as the F4BM series but utilize Reverse Treated Foil (RTF) copper. This configuration delivers excellent Passive Intermodulation (PIM) performance, more precise circuit control, and lower conductor loss, making it ideal for applications with stringent PIM requirements. F4BME255 is the variant with a dielectric constant of 2.55.


Technical Features & Benefits

  • Selectable Dielectric Constant (Dk) from 2.17 to 3.0; Dk 2.55 with customizable options available
  • Low dissipation factor (Df 0.0013 @ 10GHz, 0.0018 @ 20GHz)
  • Excellent PIM performance (≤ -159 dBc) due to Reverse Treated Foil (RTF) copper
  • More precise line control and lower conductor loss
  • Good dimensional stability and enhanced size control
  • Radiation resistance and low outgassing
  • Commercial, high-volume, cost-effective production
  • UL 94 V-0 flammability rating
  • Long-term operating temperature: -55°C to +260°C
  • Very low moisture absorption (≤0.08%)

Wangling F4BME255 Laminate


Typical Properties: F4BME255

Properties Test Conditions Unit F4BME255
Electrical Properties
Dielectric Constant (Typical)10 GHz2.55
Dielectric Constant Tolerance±0.05
Dissipation Factor (Typical)10 GHz0.0013
20 GHz0.0018
Temperature Coefficient of Dk-55°C to 150°Cppm/°C-110
Peel Strength1 oz. F4BMEN/mm>1.6
Volume ResistivityNormal ConditionMΩ·cm≥6×10⁶
Surface ResistanceNormal Condition≥1×10⁶
Dielectric Strength (Z-direction)5 kW, 500 V/skV/mm>25
Breakdown Voltage (XY-direction)5 kW, 500 V/skV>34
PIM PerformanceOnly for F4BME seriesdBc≤ -159
Thermal & Mechanical Properties
CTEXY-direction, -55°C to 288°Cppm/°C16~21
Z-direction, -55°C to 288°Cppm/°C173
Thermal Stress260°C, 10s, 3 cyclesNo Delamination
Water Absorption20±2°C, 24 hours%≤0.08
DensityRoom Temperatureg/cm³2.25
Long-term Operating Temperature°C-55 to +260
Thermal ConductivityZ-directionW/(m·K)0.33
Flammability RatingUL-94V-0
Material CompositionPTFE, Glass Fiber Cloth; F4BME uses Reverse Treated Foil (RTF) copper

Application Areas

  • Microwave, RF, Radar
  • Phase Shifters, Passive Components
  • Power Dividers, Couplers, Combiners
  • Feed Networks, Phased Array Antennas
  • Satellite Communication, Base Station Antennas

Available Configurations

  • Copper Foil Options for F4BME: Reverse Treated Foil (RTF) Copper. Available thicknesses: 0.5 oz (0.018mm), 1 oz (0.035mm).
  • Standard Panel Sizes Available:
    • 460 × 610 mm
    • 500 × 600 mm
    • 850 × 1200 mm
    • 914 × 1220 mm
    • 1000 × 1200 mm
  • Available Thicknesses & Tolerances (Conventional):
    • Thickness (mm): 0.1 (core), 0.127 (core), 0.2, 0.25, 0.5, 0.508, 0.762, 0.8, 1.0, 1.5, 1.524, 1.575, 2.0, 2.5, 3.0, 4.0, 5.0, 6.0, 8.0, 10.0, 12.0.
    • Corresponding tolerances range from ±0.01mm to ±0.20mm.
    • Note: For Dk ≤ 2.65, minimum core thickness is 0.1mm.
  • F4BME Series with Metal Core (Aluminum/Copper Base):
    • Models: F4BME*-AL (Aluminum base), F4BME*-CU (Copper base)
    • Serves for shielding or heat dissipation
    • Example: F4BME255-AL represents F4BME255 with aluminum base; F4BME255-CU represents F4BME255 with copper base
    • Standard sizes available: 460×610 mm, 460×305 mm; other sizes upon request

 


 

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