Double Sided PCB Built On 60mil Rogers TC350 With Immersion Gold for Thermally Cycled Antennas
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Overview of Rogers' TC350
Rogers' TC350 is a woven fiberglass reinforced, ceramic-filled, PTFE-based composite material designed for printed circuit board (PCB) applications. It is engineered for enhanced heat transfer through "Best-In-Class" thermal conductivity, while minimizing dielectric and insertion losses. This reduction in losses leads to improved amplifier and antenna efficiencies.
Features and Benefits
1.Enhanced Thermal Conductivity: TC350's high thermal conductivity allows for increased power handling, reduces hot spots, and improves device reliability. This results in lower junction temperatures and extends the life of active components, which is crucial for enhancing power amplifier reliability, increasing mean time between failures (MTBF), and minimizing warranty costs.
2.Excellent Dielectric Constant Stability: TC350 demonstrates outstanding dielectric constant stability across a wide temperature range, aiding power amplifier and antenna designers in maximizing gain and minimizing bandwidth loss due to dielectric constant drift as operating temperatures change.
3.Strong Bond to Copper: The material forms a robust bond with microwave-grade, low-profile copper, resulting in even lower insertion loss due to skin effect losses, which are particularly significant at higher RF and microwave frequencies.
PCB Capabilities
Our PCB Capability (TC350) |
|
PCB Material: |
Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite |
Designation: |
TC350 |
Dielectric constant: |
3.5±0.05 |
Thermal Conductivity |
0.72 W/m-K |
Dissipation Factor |
Df .002@10 GHz |
Layer count: |
Single Layer, Double Layer, Multi-layer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion silver, Immersion tin, ENEPIG, Pure gold etc.. |
Typical Applications
1.Microwave combiners and power dividers
2.Power amplifiers, filters, and couplers
3.Tower-mounted amplifiers (TMA) and tower-mounted boosters (TMB)
4.Thermally cycled antennas sensitive to dielectric drift
Typical Properties of TC350
Typical Properties:TC350 |
|||
Property |
Units |
Value |
Test Merthod |
1. Electrical Properties |
|
||
Dielectric Constant (may vary by thickness) |
|
|
|
@1 MHz |
－ |
3.50 |
IPC TM-650 2.5.5.3 |
@1.8 GHz |
－ |
3.50 |
RESONANT CAVITY |
@10 GHz |
－ |
3.50 |
IPC TM-650 2.5.5.5 |
Dissipation Factor |
|
|
|
@1 MHz |
－ |
0.0015 |
IPC TM-650 2.5.5.3 |
@1.8 GHz |
－ |
0.0018 |
RESONANT CAVITY |
@10 GHz |
－ |
0.0020 |
IPC TM-650 2.5.5.5 |
Temperature Coefficient of Dielectric |
－ |
|
|
TC r @ 10 GHz (-40-150°C) |
ppm/ºC |
-9 |
IPC TM-650 2.5.5.5 |
Volume Resistivity |
|
|
|
C96/35/90 |
MΩ-cm |
7.4x106 |
IPC TM-650 2.5.17.1 |
E24/125 |
MΩ-cm |
1.4x108 |
|
Surface Resistivity |
|
|
|
C96/35/90 |
MΩ |
3.2x107 |
IPC TM-650 2.5.17.1 |
E24/125 |
MΩ |
4.3x108 |
IPC TM-650 2.5.17.1 |
Electrical Strength |
Volts/mil (kV/mm) |
780 (31) |
IPC TM-650 2.5.6.2 |
Dielectric Breakdown |
kV |
40 |
IPC TM-650 2.5.6 |
Arc Resistance |
sec |
>240 |
IPC TM-650 2.5.1 |
2.Thermal Properties |
|
||
Decomposition Temperature (Td) |
|
|
|
Initial |
°C |
520 |
IPC TM-650 2.4.24.6 |
5% |
°C |
567 |
IPC TM-650 2.4.24.6 |
T260 |
min |
>60 |
IPC TM-650 2.4.24.1 |
T288 |
min |
>60 |
IPC TM-650 2.4.24.1 |
T300 |
min |
>60 |
IPC TM-650 2.4.24.1 |
Thermal Expansion, CTE (x,y) 50-150ºC |
ppm/ºC |
7, 7 |
IPC TM-650 2.4.41 |
Thermal Expansion, CTE (z) 50-150ºC |
ppm/ºC |
23 |
IPC TM-650 2.4.24 |
% z-axis Expansion (50-260ºC) |
% |
1.2 |
IPC TM-650 2.4.24 |
3. Mechanical Properties |
|
||
Peel Strength to Copper (1 oz/35 micron) |
|
|
|
After Thermal Stress |
lb/in (N/mm) |
7 (1.2) |
IPC TM-650 2.4.8 |
At Elevated Temperatures (150ºC) |
lb/in (N/mm) |
9 (1.6) |
IPC TM-650 2.4.8.2 |
After Process Solutions |
lb/in (N/mm) |
7 (1.2) |
IPC TM-650 2.4.8 |
Young’s Modulus |
kpsi (MPa) |
|
IPC TM-650 2.4.18.3 |
Flexural Strength (Machine/Cross) |
kpsi (MPa) |
14/10 (97/69) |
IPC TM-650 2.4.4 |
Tensile Strength (Machine/Cross) |
kpsi (MPa) |
11/8 (76/55) |
IPC TM-650 2.4.18.3 |
Compressive Modulus |
kpsi (MPa) |
|
ASTM D-3410 |
Poisson’s Ratio |
－ |
|
ASTM D-3039 |
4. Physical Properties |
|
||
Water Absorption |
% |
0.05 |
IPC TM-650 2.6.2.1 |
Density, ambient 23ºC |
g/cm3 |
2.30 |
ASTM D792 Method A |
Thermal Conductivity |
W/mK |
0.72 |
ASTM D5470 |
Specific Heat |
J/gK |
0.90 |
ASTM D5470 |
Flammability |
class |
V-0 |
UL-94 |
NASA Outgassing, 125ºC, ≤10- 6 torr |
|
|
|
Total Mass Loss |
% |
0.02 |
NASA SP-R-0022A |
Collected Volatiles |
% |
0.01 |
NASA SP-R-0022A |
Water Vapor Recovered |
% |
0.01 |
NASA SP-R-0022A |