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Rogers TMM10i Microwave Printed Circuit Board 75mil 1.905mm RF PCB With Pure Gold Plated

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description

This type of Microwave PCB is built on a 75 mil TMM10i substrate with 1 oz copper (finished). It is a double-layer board without solder mask and silkscreen. The surface finish on pads is pure gold plated with 80 micro inches, with no nickel under gold. The boards are manufactured according to IPC Class II standards, with every 25 boards packed for shipment.



PCB Capabilities

Click to expand/collapse the table

PCB SIZE

75 x 68mm=1up

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

NO

LAYER STACKUP

copper ------- 17um(0.5 oz)+plate TOP layer

TMM10i 1.905mm

copper ------- 17um(0.5 oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

10 mil / 10 mil

Minimum / Maximum Holes:

0.45 mm / 3.50 mm

Number of Different Holes:

3

Number of Drill Holes:

3

Number of Milled Slots:

0

Number of Internal Cutouts:

no

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

TMM10i 1.905mm

Final foil external:

1.0 oz

Final foil internal:

N/A

Final height of PCB:

2.0 mm ±0.1

PLATING AND COATING

 

Surface Finish

Pure Gold-Plated (No nickle under gold), 52%

Solder Mask Apply To:

N/A

Solder Mask Color:

N/A

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

N/A

Colour of Component Legend

N/A

Manufacturer Name or Logo:

N/A

VIA

Plated through hole(PTH), minimum size 0.45mm.

FLAMIBILITY RATING

94V-0

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.


Typical Applications

1.Chip Testers
2.Dielectric Polarizers and Lenses
3.Filters and Couplers
4.Global Positioning Systems Antennas
5.Patch Antennas
6.Power Amplifiers and Combiners
7.RF and Microwave Circuitry
8.Satellite Communication Systems


Our PCB Capability (TMM10i)

PCB Capability (TMM10i)

PCB Material:

Ceramic, Hydrocarbon, Thermoset Polymer Composites

Designation:

TMM10i

Dielectric constant:

9.80 ±0.245

Layer count:

Double Layer, Multilayer, Hybrid PCB

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm),        150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm),         275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion tin, OSP, Pure Gold Plated (No Nickle under gold) etc..


Data Sheet of (TMM10i)

Click to expand/collapse the table

TMM10i Typical Value

Property

TMM10i

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

9.80±0.245

Z

 

10 GHz

IPC-TM-650 2.5.5.5

Dielectric Constant,εDesign

9.9

-

-

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor (process)

0.002

Z

-

10 GHz

IPC-TM-650 2.5.5.5

Thermal Coefficient of dielectric constant

-43

-

ppm/°K

-55℃-125℃

IPC-TM-650 2.5.5.5

Insulation Resistance

>2000

-

Gohm

C/96/60/95

ASTM D257

Volume Resistivity

2 x 108

-

Mohm.cm

-

ASTM D257

Surface Resistivity

4 x 107

-

Mohm

-

ASTM D257

Electrical Strength(dielectric strength)

267

Z

V/mil

-

IPC-TM-650 method 2.5.6.2

Thermal Properties

Decompositioin Temperature(Td)

425

425

℃TGA

-

ASTM D3850

Coefficient of Thermal Expansion - x

19

X

ppm/K

0 to 140 ℃

ASTM E 831 IPC-TM-650, 2.4.41

Coefficient of Thermal Expansion - Y

19

Y

ppm/K

0 to 140 ℃

ASTM E 831 IPC-TM-650, 2.4.41

Coefficient of Thermal Expansion - Z

20

Z

ppm/K

0 to 140 ℃

ASTM E 831 IPC-TM-650, 2.4.41

Thermal Conductivity

0.76

Z

W/m/K

80 ℃

ASTM C518

Mechanical Properties

Copper Peel Strength after Thermal Stress

5.0 (0.9)

X,Y

lb/inch (N/mm)

after solder float 1 oz. EDC

IPC-TM-650 Method 2.4.8

Flexural Strength (MD/CMD)

-

X,Y

kpsi

A

ASTM D790

Flexural Modulus (MD/CMD)

1.8

X,Y

Mpsi

A

ASTM D790

Physical Properties

Moisture Absorption (2X2)

1.27mm (0.050")

0.16

-

%

D/24/23

ASTM D570

3.18mm (0.125")

0.13

Specific Gravity

2.77

-

-

A

ASTM D792

Specific Heat Capacity

0.72

-

J/g/K

A

Calculated

Lead-Free Process Compatible

YES

-

-

-

-



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