F4BM High Frequency PCB Advanced Laminates for Enhanced Performance
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Introduction
The F4BM High Frequency PCB series is crafted from a scientifically formulated blend of fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. This design improves electrical performance compared to the F4B series, featuring a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and enhanced stability, making it a suitable replacement for similar foreign products.
The F4BM and F4BME variants share the same dielectric layer but differ in copper foil combinations: F4BM uses ED copper foil for applications without Passive Intermodulation (PIM) requirements, while F4BME utilizes reverse-treated foil (RTF) copper foil for superior PIM performance, precise line control, and reduced conductor loss.
By adjusting the ratio of PTFE to fiberglass cloth, both variants achieve precise dielectric constant control, ensuring low loss and improved dimensional stability. A higher dielectric constant is linked to a greater fiberglass proportion, enhancing dimensional stability and reducing thermal expansion.
Features & Benefits
Customizable dielectric constant (DK) options: 2.17 to 3.0
Low loss characteristics
F4BME with RTF copper foil for excellent PIM performance
Cost-effective and diverse size options
Radiation resistance and low outgassing
Commercially available with large-scale production
Laminate Models and Data Sheet
| Product Technical Parameters | Product Model & Data Sheet | |||||||||||
| Product Features | Test Conditions | Unit | F4BM217 | F4BM220 | F4BM233 | F4BM245 | F4BM255 | F4BM265 | F4BM275 | F4BM294 | F4BM300 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.17 | 2.2 | 2.33 | 2.45 | 2.55 | 2.65 | 2.75 | 2.94 | 3.0 | |
| Dielectric Constant Tolerance | / | / | ±0.04 | ±0.04 | ±0.04 | ±0.05 | ±0.05 | ±0.05 | ±0.05 | ±0.06 | ±0.06 | |
| Loss Tangent (Typical) | 10GHz | / | 0.001 | 0.001 | 0.0011 | 0.0012 | 0.0013 | 0.0013 | 0.0015 | 0.0016 | 0.0017 | |
| 20GHz | / | 0.0014 | 0.0014 | 0.0015 | 0.0017 | 0.0018 | 0.0019 | 0.0021 | 0.0023 | 0.0025 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -150 | -142 | -130 | -120 | -110 | -100 | -92 | -85 | -80 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW，500V/s | KV/mm | >23 | >23 | >23 | >25 | >25 | >25 | >28 | >30 | >30 | |
| Breakdown Voltage (XY direction) | 5KW，500V/s | KV | >30 | >30 | >32 | >32 | >34 | >34 | >35 | >36 | >36 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 25, 34 | 25, 34 | 22, 30 | 20, 25 | 16, 21 | 14, 17 | 14, 16 | 12, 15 | 12, 15 |
| Z direction | -55 º~288ºC | ppm/ºC | 240 | 240 | 205 | 187 | 173 | 142 | 112 | 98 | 95 | |
| Thermal Stress | 260℃, 10s，3 times | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.17 | 2.18 | 2.20 | 2.22 | 2.25 | 2.25 | 2.28 | 2.29 | 2.29 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.24 | 0.24 | 0.28 | 0.30 | 0.33 | 0.36 | 0.38 | 0.41 | 0.42 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
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Our PCB Capability (F4BM)
| PCB Capability (F4BM) | |||
| PCB Material: | PTFE glass fiber cloth copper clad laminates | ||
| Designation (F4BM ) | F4BM | DK (10GHz) | DF (10 GHz) |
| F4BM217 | 2.17±0.04 | 0.0010 | |
| F4BM220 | 2.20±0.04 | 0.0010 | |
| F4BM233 | 2.33±0.04 | 0.0011 | |
| F4BM245 | 2.45±0.05 | 0.0012 | |
| F4BM255 | 2.55±0.05 | 0.0013 | |
| F4BM265 | 2.65±0.05 | 0.0013 | |
| F4BM275 | 2.75±0.05 | 0.0015 | |
| F4BM294 | 2.94±0.06 | 0.0016 | |
| F4BM300 | 3.00±0.06 | 0.0017 | |
| Layer count: | Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB | ||
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) | ||
| Dielectric thickness (or overall thickness) | 0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm | ||
| PCB size: | ≤400mm X 500mm | ||
| Solder mask: | Green, Black, Blue, Yellow, Red etc. | ||
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. | ||
Applications
An example of a 2-layer copper high-frequency PCB constructed with F4BM material and a low DK of 2.2 is shown, featuring HASL surface finish on a 3.0mm substrate.
The F4BM High Frequency PCB is ideal for microwave, RF, and radar systems, including phase shifters, passive components, power dividers, couplers, combiners, feed networks, phased array antennas, satellite communications, and base station antennas.
Final Note on F4BM Series Boards
The F4BM series laminates can be produced with either aluminum-based or copper-based materials, where one side features copper foil and the other is covered with aluminum or copper for shielding or heat dissipation.