F4BTMS1000 High Frequency PCB High DK10.2 PTFE 3.2mm Substrates with Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

This double-sided PCB features circuitry on both the top and bottom layers, each with a copper weight of 2 oz. The middle layer consists of an F4BTMS1000 core, measuring 3.175 mm in thickness. The PCB size is 215 mm x 145 mm, with a single unit in the panel. It is equipped with surface mount components and does not include any through-hole components. The surface finish is immersion gold, and a black solder mask is applied to the top side of the PCB. Prior to shipment, a comprehensive 100% electrical test is conducted to ensure functionality and uphold quality standards.

The layer stackup consists of a top layer made of 70 µm (2 oz) copper starting with 1 oz plating, complemented by a durable F4BM300 core material with a thickness of 0.508 mm. The bottom layer also incorporates 70 µm (2 oz) copper with plating, ensuring reliable performance.

The surface finish is immersion gold, which enhances solderability and provides excellent protection against corrosion. A black solder mask is applied to the top side of the PCB, offering both durability and a sleek appearance while safeguarding the underlying circuitry.

PCB Specifications

F4BTMS High-Frequency Laminate

The F4BTMS series is an upgraded version of the F4BTM series. Significant advancements have been made in material formulation and manufacturing processes. This material incorporates a large amount of ceramics and utilizes ultra-thin and ultra-fine fiberglass cloth reinforcement. These enhancements have greatly improved performance, resulting in a wider range of dielectric constants. It is a high-reliability material suitable for aerospace applications and can replace similar foreign products.

By incorporating ultra-thin fiberglass cloth reinforcement and a uniform mixture of special nanoceramics and polytetrafluoroethylene resin, the F4BTMS series minimizes dielectric loss and enhances dimensional stability. The material exhibits reduced anisotropy in the X/Y/Z directions, allowing for higher frequency usage, increased electrical strength, and improved thermal conductivity. It also possesses an excellent low coefficient of thermal expansion and stable dielectric temperature characteristics.

The F4BTMS series comes standard with RTF low roughness copper foil, which reduces conductor loss and provides excellent peel strength. It can be paired with copper-based or aluminum-based options.

Features

Small dielectric constant tolerance and good consistency between batches.
Ultra-low dielectric loss.
Stable dielectric constant and low loss value at operating frequencies within 40 GHz, suitable for phase-sensitive applications.
Excellent temperature coefficient of dielectric constant and dielectric loss, maintaining stability between -55°C and 150°C.
Excellent radiation resistance; retains stable dielectric and physical properties after irradiation.
Low outgassing performance, meeting vacuum exhaust requirements for aerospace applications.
Minimal thermal expansion coefficients in the X/Y/Z directions, ensuring dimensional stability and reliability of hole copper connections.
Improved thermal conductivity, suitable for high-power applications.
Excellent dimensional stability.
Low water absorption.

Typical Applications

Aerospace equipment, space and cabin equipment
Microwave and RF applications
Radar and military radar systems
Feed networks
Phase-sensitive antennas and phased array antennas
Satellite communications, etc.

Data Sheet (F4BTMS)