F4BME220 High-Frequency PCB PTFE DK2.2 Dual Layer Affordable RF PWB for Couplers
(Please note that Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.)
Brief Introduction
The F4BME220 PCB measures 100 x 100 mm and is designed as a dual-layer, double-sided board. This board is optimized for surface mount components and does not accommodate through-hole components. The layer stackup features a top layer composed of 35 µm (1 oz) copper, starting with 0.5 oz plating, paired with a sturdy F4BME220 core material that is 1.0 mm thick, and a corresponding 35 µm (1 oz) copper bottom layer. The surface finish is Organic Solderability Preservative (OSP), ensuring excellent soldering performance. Importantly, this PCB is not equipped with a solder mask.
PCB Specifications
F4BME220 High Frequency PCB On DK2.2 Dual Layer Cheap RF PTFE PWB for Couplers |
|
PCB SIZE |
100 x 100mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 35um(0.5 oz +plate) TOP layer |
F4BME220 1.0mm |
|
copper ------- 35um(0.5 oz + plate) BOT Layer |
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TECHNOLOGY |
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Minimum Trace and Space: |
10 mil / 10 mil |
Minimum / Maximum Holes: |
0.4 mm / 0.4 mm |
Number of Different Holes: |
1 |
Number of Drill Holes: |
1 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
F4BME220 DK 2.2 |
Final foil external: |
1oz |
Final foil internal: |
N/A |
Final height of PCB: |
1.1 mm ±10% |
PLATING AND COATING |
|
Surface Finish |
OSP |
Solder Mask Apply To: |
no |
Solder Mask Color: |
no |
Solder Mask Type: |
no |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
NO |
Colour of Component Legend |
NO |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Non-Plated through hole(PTH), minimum size 0.4mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
F4BME High-Frequency Laminates
The F4BME series laminates are crafted through a scientific formulation and rigorous pressing of fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. The electrical performance of F4BME laminates surpasses that of F4B, mainly due to a broader range of dielectric constants, reduced dielectric loss, enhanced insulation resistance, and improved stability. These laminates can effectively replace similar foreign products.
Features
1.Customizable DK: Options range from DK2.17 to 3.0.
2.Low Loss: Optimized for minimal signal loss.
3.Exceptional PIM Index:F4BME with RTF copper foil delivers outstanding passive intermodulation performance.
4.Diverse Sizes: Available in various sizes for cost efficiency.
5.Irradiation Resistance: Low emissions and high durability.
6.Commercial Viability: Suited for mass production with excellent cost-performance ratio.
Typical Applications
.Microwave ,radar and RF applications
.Phase shifters and passive components
.Power dividers, couplers, and combiners
.Feed networks and phased array antennas
.Satellite communications and base station antennas
Our PCB Capability (F4BME)
PCB Capability (F4BME) |
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PCB Material: |
PTFE glass fiber cloth copper clad laminates |
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Designation (F4BME ) |
F4BME |
DK (10GHz) |
DF (10 GHz) |
F4BME217 |
2.17±0.04 |
0.0010 |
|
F4BME220 |
2.20±0.04 |
0.0010 |
|
F4BME233 |
2.33±0.04 |
0.0011 |
|
F4BME245 |
2.45±0.05 |
0.0012 |
|
F4BME255 |
2.55±0.05 |
0.0013 |
|
F4BME265 |
2.65±0.05 |
0.0013 |
|
F4BME275 |
2.75±0.05 |
0.0015 |
|
F4BME294 |
2.94±0.06 |
0.0016 |
|
F4BME300 |
3.00±0.06 |
0.0017 |
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Layer count: |
Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
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Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
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Dielectric thickness (or overall thickness) |
0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm |
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PCB size: |
≤400mm X 500mm |
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Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
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Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
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Data Sheets (F4BME)
Product Technical Parameters |
Product Models & Data Sheet |
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Product Features |
Test Conditions |
Unit |
F4BTM298 |
F4BTM300 |
F4BTM320 |
F4BTM350 |
|
Dielectric Constant (Typical) |
10GHz |
/ |
2.98 |
3.0 |
3.2 |
3.5 |
|
Dielectric Constant Tolerance |
/ |
/ |
±0.06 |
±0.06 |
±0.06 |
±0.07 |
|
Loss Tangent (Typical) |
10GHz |
/ |
0.0018 |
0.0018 |
0.0020 |
0.0025 |
|
20GHz |
/ |
0.0023 |
0.0023 |
0.0026 |
0.0035 |
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Dielectric Constant Temperature Coefficient |
-55 º~150ºC |
PPM/℃ |
-78 |
-75 |
-75 |
-60 |
|
Peel Strength |
1 OZ F4BTM |
N/mm |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
|
1 OZ F4BTME |
N/mm |
>1.4 |
>1.4 |
>1.4 |
>1.4 |
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Volume Resistivity |
Standard Condition |
MΩ.cm |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
|
Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
|
Electrical Strength (Z direction) |
5KW，500V/s |
KV/mm |
>26 |
>30 |
>32 |
>32 |
|
Breakdown Voltage (XY direction) |
5KW，500V/s |
KV |
>34 |
>35 |
>40 |
>40 |
|
Coefficientof Thermal Expansion |
XY direction |
-55 º~288ºC |
ppm/ºC |
15，16 |
15，16 |
13，15 |
10，12 |
Z direction |
-55 º~288ºC |
ppm/ºC |
78 |
72 |
58 |
51 |
|
Thermal Stress |
260℃, 10s，3 times |
No delamination |
No delamination |
No delamination |
No delamination |
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Water Absorption |
20±2℃, 24 hours |
% |
≤0.05 |
≤0.05 |
≤0.05 |
≤0.05 |
|
Density |
Room Temperature |
g/cm3 |
2.25 |
2.25 |
2.20 |
2.20 |
|
Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
|
Thermal Conductivity |
Z direction |
W/(M.K) |
0.42 |
0.42 |
0.50 |
0.54 |
|
PIM |
Only applicable to F4BTME |
dBc |
≤-160 |
≤-160 |
≤-160 |
≤-160 |
|
Flammability |
/ |
UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
|
Material Composition |
/ |
/ |
PTFE, Fiberglass Cloth, nano-ceramics |
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