Home > F4B PCB > F4BTM298 High Frequency PCB 3.0mm Substrates RF PCB Board with Immersion Tin
F4BTM298 High Frequency PCB 3.0mm Substrates RF PCB Board with Immersion Tin

(Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.)


General Description

The F4BTM298 is a high-frequency, double-sided PCB specifically designed for patch antenna applications and constructed on a 3.0mm substrate.


Basic Specifications

Item Specification
Base Material F4BTM298
Dielectric Constant 2.98 ± 0.06
Layer Count 2 Layers
Type Through holes
Dimensions 110mm x 35mm (1 type = 1 piece)
Surface Finish Immersion tin
Copper Weight Outer layer 35 μm
Solder Mask / Legend None / None
Final PCB Height 3.1 mm
Standard Compliance IPC 6012 Class 2
Packing 20 pieces per shipment
Lead Time 7 working days
Shelf Life 6 months


Applications

.Multiplexer
.Acoustic Detection Sensors
.Radio Frequency (RF)
.RF Transceiver


F4BTM High Frequency Laminates

The F4BTM series of high-frequency materials are composed of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene resin, developed through rigorous preparation and precise pressing processes.


This series of products builds upon the F4BM dielectric layer, added with high-dielectric, low-loss nanoscale ceramics, resulting in superior dielectric constants, improved heat resistance, lower thermal expansion coefficients, higher insulation resistance, and enhanced thermal conductivity—all while preserving low loss characteristics.


Our PCB Capability (F4BTM)

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PCB Capability (F4BTM)

PCB Material:

PTFE / glass fiber cloth / Nano-ceramic filler

Designation               (F4BTM )

F4BTM

DK (10GHz)

DF (10 GHz)

F4BTM298

2.98±0.06

0.0018

F4BTM300

3.0±0.06

0.0018

F4BTM320

3.2±0.06

0.0020

F4BTM350

3.5±0.07

0.0025

Layer count:

Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

Dielectric thickness               (or overall thickness)

0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..


Data Sheet (F4BTM)

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Product Technical Parameters

Product Models & Data Sheet

Product Features

Test Conditions

Unit

F4BTM298

F4BTM300

F4BTM320

F4BTM350

Dielectric Constant (Typical)

10GHz

/

2.98

3.0

3.2

3.5

Dielectric Constant Tolerance

/

/

±0.06

±0.06

±0.06

±0.07

Loss Tangent (Typical)

10GHz

/

0.0018

0.0018

0.0020

0.0025

20GHz

/

0.0023

0.0023

0.0026

0.0035

Dielectric Constant Temperature Coefficient

-55 º~150ºC

PPM/℃

-78

-75

-75

-60

Peel Strength

1 OZ F4BTM

N/mm

>1.6

>1.6

>1.6

>1.6

1 OZ F4BTME

N/mm

>1.4

>1.4

>1.4

>1.4

Volume Resistivity

Standard Condition

MΩ.cm

≥1×10^7

≥1×10^7

≥1×10^7

≥1×10^7

Surface Resistivity

Standard Condition

≥1×10^6

≥1×10^6

≥1×10^6

≥1×10^6

Electrical Strength (Z direction)

5KW,500V/s

KV/mm

>26

>30

>32

>32

Breakdown Voltage (XY direction)

5KW,500V/s

KV

>34

>35

>40

>40

Coefficientof Thermal Expansion  

XY direction

-55 º~288ºC

ppm/ºC

15,16

15,16

13,15

10,12

Z direction

-55 º~288ºC

ppm/ºC

78

72

58

51

Thermal Stress

260℃, 10s,3 times

No delamination

No delamination

No delamination

No delamination

Water Absorption

20±2℃, 24 hours

%

≤0.05

≤0.05

≤0.05

≤0.05

Density

Room Temperature

g/cm3

2.25

2.25

2.20

2.20

Long-Term Operating Temperature

High-Low Temperature Chamber

-55~+260

-55~+260

-55~+260

-55~+260

Thermal Conductivity

Z direction

W/(M.K)

0.42

0.42

0.50

0.54

PIM

Only applicable to F4BTME

dBc

≤-160

≤-160

≤-160

≤-160

Flammability

/

UL-94

V-0

V-0

V-0

V-0

Material Composition

/

/

PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.


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