F4BME265 High Frequency PCB DK2.65 PTFE Double-Sided with OSP and Green Mask
(Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.)
Brief Introduction
The PCB we are discussing today measures 89mm x 61mm and contains a single piece per panel. This is a double-sided PCB, featuring two conductive layers for circuitry. It does not include any surface mount components; instead, it is equipped with through-hole components. The layer stack comprises copper layers with a finished thickness of 35µm (equivalent to 1oz). Sandwiched in between is F4BME265 material, which has a thickness of 1.5mm, followed by another copper layer of the same 35µm (1oz) thickness on the opposite side after plating.
PCB Specifications
F4BME265 High Frequency PCB DK2.65 PTFE Double Sided With OSP and Green Mask |
|
PCB SIZE |
89 x 61mm=1PCS |
BOARD TYPE |
Microwave PCB |
Number of Layers |
Double sided PCB |
Surface Mount Components |
NO |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 18um(0.5oz)+PLATE |
F4BME265 1.524mm |
|
copper ------- 18um(0.5oz)+PLATE |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
6mil/9mil |
Minimum / Maximum Holes: |
0.9/2.3mm |
Number of Different Holes: |
3 |
Number of Drill Holes: |
156 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
1 |
Impedance Control |
no |
BOARD MATERIAL |
|
Glass Epoxy: |
F4BME265 dk2.65 |
Final foil external: |
1oz |
Final foil internal: |
1oz |
Final height of PCB: |
1.6 mm ±0.16 |
PLATING AND COATING |
|
Surface Finish |
OSP, Thickness >0.2µm |
Solder Mask Apply To: |
TOP, 12micron Minimum |
Solder Mask Color: |
Gloss Green, Taiyo PSR-2000GT600D |
Solder Mask Type: |
LPSM |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
No silkscreen required. |
Colour of Component Legend |
No silkscreen required. |
Manufacturer Name or Logo: |
No silkscreen required. |
VIA |
Plated through hole(PTH), via open. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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F4BME High Frequency Laminates
F4BME series laminates are produced through a precise formulation and strict pressing of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Compared to F4B, these laminates demonstrate enhanced electrical performance, characterized by a broader range of dielectric constants, reduced dielectric loss, improved insulation resistance, and increased stability. They are capable of replacing similar foreign products.
Product Features
.Customizable DK: Options range from DK2.17 to 3.0.
.Low Loss: Designed for efficient performance
.Excellent PIM Index: F4BME with RTF copper foil achieves outstanding performance metrics.
.Diverse Sizes & Cost Efficiency: Accommodates various applications while optimizing costs.
.Irradiation Resistance & Low Emissions: Built to endure challenging environments.
.Commercial Viability: Suitable for mass production with high cost-performance ratio.
Typical Applications
.Microwave, RF, radar technologies
.Phase shifters and passive components
.Power dividers, couplers, and combiners
.Feed networks and phased array antennas
.Satellite communications and base station antennas
Data Sheet (F4BME)
Product Technical Parameters |
Product Models & Data Sheet |
||||||
Product Features |
Test Conditions |
Unit |
F4BTM298 |
F4BTM300 |
F4BTM320 |
F4BTM350 |
|
Dielectric Constant (Typical) |
10GHz |
/ |
2.98 |
3.0 |
3.2 |
3.5 |
|
Dielectric Constant Tolerance |
/ |
/ |
±0.06 |
±0.06 |
±0.06 |
±0.07 |
|
Loss Tangent (Typical) |
10GHz |
/ |
0.0018 |
0.0018 |
0.0020 |
0.0025 |
|
20GHz |
/ |
0.0023 |
0.0023 |
0.0026 |
0.0035 |
||
Dielectric Constant Temperature Coefficient |
-55 º~150ºC |
PPM/℃ |
-78 |
-75 |
-75 |
-60 |
|
Peel Strength |
1 OZ F4BTM |
N/mm |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
|
1 OZ F4BTME |
N/mm |
>1.4 |
>1.4 |
>1.4 |
>1.4 |
||
Volume Resistivity |
Standard Condition |
MΩ.cm |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
|
Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
|
Electrical Strength (Z direction) |
5KW，500V/s |
KV/mm |
>26 |
>30 |
>32 |
>32 |
|
Breakdown Voltage (XY direction) |
5KW，500V/s |
KV |
>34 |
>35 |
>40 |
>40 |
|
Coefficientof Thermal Expansion |
XY direction |
-55 º~288ºC |
ppm/ºC |
15，16 |
15，16 |
13，15 |
10，12 |
Z direction |
-55 º~288ºC |
ppm/ºC |
78 |
72 |
58 |
51 |
|
Thermal Stress |
260℃, 10s，3 times |
No delamination |
No delamination |
No delamination |
No delamination |
||
Water Absorption |
20±2℃, 24 hours |
% |
≤0.05 |
≤0.05 |
≤0.05 |
≤0.05 |
|
Density |
Room Temperature |
g/cm3 |
2.25 |
2.25 |
2.20 |
2.20 |
|
Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
|
Thermal Conductivity |
Z direction |
W/(M.K) |
0.42 |
0.42 |
0.50 |
0.54 |
|
PIM |
Only applicable to F4BTME |
dBc |
≤-160 |
≤-160 |
≤-160 |
≤-160 |
|
Flammability |
/ |
UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
|
Material Composition |
/ |
/ |
PTFE, Fiberglass Cloth, nano-ceramics |
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