F4BTM350 High-Frequency PCB Board 1.5mm PTFE Plate with 3oz Copper and Immersion Silver Finish
(Note: Printed Circuit Boards (PCBs) are custom-made products. The images and parameters provided are for reference purposes only.)
PCB Specifications Overview
This high-frequency PCB is a double-sided printed circuit board (PCB) built on F4BTM350 high-frequency laminates, designed for top-level performance and durability. Measuring a compact 67mm x 85mm, this board is optimized for surface-mounted components on the top side.
The layer stackup features 3oz copper combined with the F4BTM350 dielectric material, offering exceptional electrical conductivity and thermal management. To ensure long-lasting performance, the PCB is finished with immersion silver plating, which improves solderability and surface protection. Additionally, a green solder mask is applied to the top layer, providing durability and a professional appearance.
Below are the key specifications for this PCB design:
F4BTM350 High Frequency PCB Board 1.5mm PTFE Plate with 3oz Copper and Immersion Silver |
|
PCB SIZE |
67mm x 85 mm =1up |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 105 um(2 oz+plate) TOP layer |
F4BTM350 - 1.524mm |
|
copper ------- 105 um(2 oz + plate) BOT Layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
7.9 mil / 5.9 mil |
Minimum / Maximum Holes: |
0.4 mm / 0.4 mm |
Number of Different Holes: |
1 |
Number of Drill Holes: |
1 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
F4BTM350 DK3.5 |
Final foil external: |
3 oz |
Final foil internal: |
N/A |
Final height of PCB: |
1.6 mm |
PLATING AND COATING |
|
Surface Finish |
Immersion Silver |
Solder Mask Apply To: |
Top side |
Solder Mask Color: |
Green |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated through hole(PTH), minimum size 0.4mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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F4BTM High-Frequency Laminates
What Are F4BTM Laminates?
The F4BTM series high-frequency laminates are constructed from a combination of glass fiber cloth, nano-ceramic filling, and polytetrafluoroethylene resin, all processed through rigorous scientific preparation and pressing techniques. This series utilizes the F4BM dielectric layer as its foundation, incorporating high-dielectric and low-loss nanoscale ceramics. As a result, these laminates achieve several enhanced properties, including:
- Higher Dielectric Constant: Improved signal propagation characteristics.
- Better Heat Resistance: Enhanced performance under elevated temperatures.
- Lower Coefficient of Thermal Expansion: Greater dimensional stability across temperature variations.
- Higher Insulation Resistance: Improved electrical performance and reliability.
- Better Thermal Conductivity: Efficient heat dissipation capabilities.
- Maintained Low Loss Characteristics: Ensures minimal energy loss during signal transmission.
These advancements make the F4BTM series suitable for a wide range of high-frequency applications, ensuring reliability and efficiency in demanding environments.
F4BTM Laminate Features
- Dielectric Constant (DK): Options range from 2.98 to 3.5
- Ceramic Additives: Improve performance and reliability
- Excellent Passive Intermodulation (PIM) Performance
- Wide Thickness Range: From 0.254mm to 12mm
- Flexible Sheet Sizes: Available in 460mm x 610mm to 914mm x 1220mm
- Cost-Effective for Mass Production: Balances performance and affordability
- Anti-Radiation Properties: Ensures durability in high-radiation environments
- Environmentally Friendly: Features low exhaust emissions
Optional Copper Foil Types
The F4BTM laminates offer a variety of copper foil thicknesses, tailored to meet specific performance and design requirements (Electrodeposited (ED) Copper): 0.5oz,1oz,1.5oz,2oz
By combining cutting-edge materials and state-of-the-art design, the F4BTM350 high-frequency PCB board delivers outstanding performance for advanced applications. Whether you're designing for high-frequency signals, thermal management, or mass production, this PCB meets the most demanding requirements while remaining cost-effective.
Data Sheet (F4BME)
Product Technical Parameters |
Product Models & Data Sheet |
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Product Features |
Test Conditions |
Unit |
F4BTM298 |
F4BTM300 |
F4BTM320 |
F4BTM350 |
|
Dielectric Constant (Typical) |
10GHz |
/ |
2.98 |
3.0 |
3.2 |
3.5 |
|
Dielectric Constant Tolerance |
/ |
/ |
±0.06 |
±0.06 |
±0.06 |
±0.07 |
|
Loss Tangent (Typical) |
10GHz |
/ |
0.0018 |
0.0018 |
0.0020 |
0.0025 |
|
20GHz |
/ |
0.0023 |
0.0023 |
0.0026 |
0.0035 |
||
Dielectric Constant Temperature Coefficient |
-55 º~150ºC |
PPM/℃ |
-78 |
-75 |
-75 |
-60 |
|
Peel Strength |
1 OZ F4BTM |
N/mm |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
|
1 OZ F4BTME |
N/mm |
>1.4 |
>1.4 |
>1.4 |
>1.4 |
||
Volume Resistivity |
Standard Condition |
MΩ.cm |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
|
Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
|
Electrical Strength (Z direction) |
5KW，500V/s |
KV/mm |
>26 |
>30 |
>32 |
>32 |
|
Breakdown Voltage (XY direction) |
5KW，500V/s |
KV |
>34 |
>35 |
>40 |
>40 |
|
Coefficientof Thermal Expansion |
XY direction |
-55 º~288ºC |
ppm/ºC |
15，16 |
15，16 |
13，15 |
10，12 |
Z direction |
-55 º~288ºC |
ppm/ºC |
78 |
72 |
58 |
51 |
|
Thermal Stress |
260℃, 10s，3 times |
No delamination |
No delamination |
No delamination |
No delamination |
||
Water Absorption |
20±2℃, 24 hours |
% |
≤0.05 |
≤0.05 |
≤0.05 |
≤0.05 |
|
Density |
Room Temperature |
g/cm3 |
2.25 |
2.25 |
2.20 |
2.20 |
|
Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
|
Thermal Conductivity |
Z direction |
W/(M.K) |
0.42 |
0.42 |
0.50 |
0.54 |
|
PIM |
Only applicable to F4BTME |
dBc |
≤-160 |
≤-160 |
≤-160 |
≤-160 |
|
Flammability |
/ |
UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
|
Material Composition |
/ |
/ |
PTFE, Fiberglass Cloth, nano-ceramics |
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