Adhesiveless Flexible Printed Circuit (FPC) Built on Polyimide with Gold Plating for Tracking Applications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description:

Introducing our Adhesiveless Flexible Printed Circuit (FPC), constructed from SF202 polyimide material, measuring 85 x 37 mm. This double-sided FPC is designed to meet the rigorous demands of modern electronics while offering exceptional durability and flexibility.

The layer stack-up features copper layers of 35 micrometers (1 oz) on both sides, ensuring optimal electrical conductivity. The design allows for a minimum trace and space requirement of 20 mil, facilitating precise and efficient signal routing.

This flexible circuit accommodates hole diameters ranging from 0.3 mm to 1.0 mm, with a final external foil thickness of 1 oz and a slim profile of just 0.15 mm (±0.05 mm). The immersion gold surface finish enhances solderability and provides excellent oxidation protection, ensuring reliable performance in various applications.

FPC Specifications:

Typical Applications:

Computers
Mobile phones
Digital cameras
VCRs
Flat panel displays
Instruments and apparatus
Automotive electronics

Parameter of SF202:

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Test Item	Test Method	Unit		IPC Standard		Typical Value
						SF202 0512DT
Peel Strength 90°	IPC-TM-650,No.2.4.9 Method A Method C	N/mm		≥0.525 ≥0.525		1.2 1.2
Thermal Stress	IPC-TM-650,No.2.4.13	-		Pass		Pass
Dimensional Stability	IPC-TM-650,No.2.2.4 Method B	%		±0.2		MD: 0.01 TD: 0
Chemical Resistance	IPC-TM-650,No.2.3.2	%		≥80		85
Moisture Absorption	IPC-TM-650,No.2.6.2	%		≤2		1.3
Volume Resistivity	IPC-TM-650,No.2.5.17	MΩ-cm		≥106		4.8×108
Surface Resistance	IPC-TM-650,No.2.5.17	MΩ		≥105		1.2×106
Dielectric Constant 1GHz	PC-TM-650,No.2.5.5.9	-		-		3.2
Dissipation Factor 1GHz	PC-TM-650,No.2.5.5.9	-		-		0.007
Bending resistance	R0.38×4.9N,with cvl	Times		-		>2000
Dielectric Strength	IPC-TM-650,No.2.5.6.2	V/μm		≥80		150

FPC Capabilities: