Heavy Copper FPC Flexible PCB with 2 oz Copper on Polyimide
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description:
Introducing our Heavy Copper Flexible Printed Circuit (FPC), specifically designed for AC power systems. This 2-layer polyimide FPC, measuring 0.3mm in thickness, features 2 oz copper. The base laminate is sourced from Shengyi, complemented by a 0.1mm FR-4 stiffener on the back. Manufactured according to IPC 6012 Class 2 standards using provided Gerber data, this FPC ensures high reliability and performance.
Parameter and data sheet
| Size of Flexible PCB | 130.66 X 40.67mm |
| Number of Layers | 2 |
| Board Type | Flexible PCB |
| Board Thickness | 0.30mm |
| Board Material | Polyimide 50µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60℃ |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 70 µm |
| Coverlay Colour | Yellow |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | FR-4 |
| Stiffener Thickness | 0.2mm |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
.jpg)
Features and Benefits:
Excellent Flexibility: Designed to withstand bending and twisting without compromising performance.
Reduced Volume: Compact design that saves space in applications.
Weight Reduction: Lightweight materials contribute to overall system efficiency.
Consistent Assembly: Reliable manufacturing processes ensure uniform assembly results.
Increased Reliability: Enhanced durability for long-lasting performance.
Whole Soldering Capability: The ends can be fully soldered for improved connections.
Cost-Effectiveness: Affordable solutions for high-quality flexible circuits.
Seamless Processing: Streamlined production processes for efficiency.
On-Time Service: Commitment to meeting delivery timelines.
Quick Lead Time: Fast turnaround of 3-5 days.
Applications
Ideal for various applications including:
General-purpose LED soft light strips
Mobile phone antenna flex boards
Industrial control systems
Temperature controller soft boards
Copper Foils:
We offer two types of copper foils for your flexible circuits: Electro-Deposited (ED) copper foils and Rolled and Annealed (RA) copper foils.
1.Electro-Deposited (ED) Copper Foils:
Produced by depositing copper on a stainless steel drum in a plating tank.
Characterized by a vertical grain structure, offering lower ductility.
Not recommended for dynamic applications.
2.Rolled and Annealed (RA) Copper Foils:
Made from electrolytically deposited cathode copper, providing a horizontal grain structure.
Offers superior flexibility and endurance, making it suitable for dynamic applications.
Can be enhanced with electrolytic copper flash for improved adhesion.
More Displays of Heavy Copper Flex:
.jpg)