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High-Performance 4-Layer HDI PCB Using RO4350B Material

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)


Introduction to RO4350B

Rogers RO4350B is a proprietary woven glass reinforced hydrocarbon/ceramic material that offers electrical performance comparable to PTFE combined with the manufacturability of epoxy/glass. This material is designed for high-frequency applications, providing low dielectric loss and tight control over dielectric constant (Dk). Unlike traditional microwave laminates, RO4350B does not require special handling or treatments for through-holes, making it a cost-effective solution for RF designs.


Key Features of RO4350B

Dielectric Constant (Dk): 3.48 ± 0.05 at 10 GHz/23°C
Dissipation Factor: 0.0037 at 10 GHz/23°C
Thermal Conductivity: 0.69 W/m·K
CTE: X-axis: 10 ppm/°C, Y-axis: 12 ppm/°C, Z-axis: 32 ppm/°C
Tg: >280°C
Low Water Absorption: 0.06%


PCB Construction Details

Parameter Details
Base Material RO4350B
Layer Count 4 layers
Board Dimensions Outline 1: 70 mm x 50 mm (1 PCS, ± 0.15 mm)
Outline 2: 70 mm x 40 mm
Minimum Trace/Space 4/7 mils
Minimum Hole Size 0.3 mm
Stepped Outline Yes
Finished Board Thickness 0.5 mm
Finished Copper Weight 1 oz (1.4 mils) for outer layers
Via Plating Thickness 20 µm
Blind and Buried Vias L1-L2, L1-L3, L2-L3
Surface Finish Immersion Gold
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask No
Bottom Solder Mask No
Electrical Testing 100% before shipment

PCB Stackup

Layer Details
Copper Layer 1 35 µm
Rogers RO4350B Core 0.762 mm (30 mil)
Copper Layer 2 35 µm
Prepreg (RO4450F) 0.102 mm (4 mil)
Copper Layer 3 35 µm
Rogers RO4350B Core 0.762 mm (30 mil)
Copper Layer 4 35 µm

PCB Statistics

Components: 9
Total Pads: 32B
Thru Hole Pads: 17
Top SMT Pads: 15
Bottom SMT Pads: 0
Vias: 23
Nets: 4



Artwork and Standards

Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide


Benefits of RO4350B

Ideal for multi-layer board (MLB) constructions
Compatible with FR-4 processing at lower fabrication costs
Excellent dimensional stability
Competitively priced


Applications

Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNBs for Direct Broadcast Satellites



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