High-Performance TU-872 Low Dk/Df FR-4 Multilayer PCBs for Superior Thermal Reliability

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)

General Description

The TU-872 SLK Sp is a high-performance multilayer printed circuit board (PCB) made from a modified epoxy FR-4 resin. This material is reinforced with advanced woven glass and is engineered to have an exceptionally low dielectric constant and low dissipation factor, making it suitable for high-speed, low-loss, and high-frequency circuit board applications. The TU-872 SLK Sp is compatible with lead-free environmental protection processes and works well with standard FR-4 manufacturing methods. Its laminates demonstrate excellent Coefficient of Thermal Expansion (CTE), superior resistance to chemicals and moisture, thermal stability, and resistance to conductive anodic filament (CAF), enhanced by a unique allyl network forming compound.

Key Features

Excellent Electrical Properties: Ensures optimal performance in various applications.
Dielectric Constant Less Than 3.5: Ideal for high-frequency applications.
Dissipation Factor Less Than 0.010: Minimizes signal loss and improves efficiency.
Stable and Flat Dk/Df Performance: Guarantees consistent performance across the board.
Compatibility with Most FR-4 Processes: Versatile for different manufacturing methods.
Lead-Free Process Compatible: Meets environmental standards.
Improved Z-Axis Thermal Expansion: Enhances reliability under thermal stress.
Anti-CAF Capability: Reduces the risk of conductive failures.
Superior Dimensional Stability, Thickness Uniformity, and Flatness: Ensures high-quality production standards.
Excellent Through-Hole and Soldering Reliability: Ensures durability and performance in assembly.

Our PCB Capabilities (TU-872 SLK Sp)

PCB Material:	High performance modified epoxy FR-4 resin
Designation:	TU-872 SLK Sp
Dielectric constant:	< 3.5
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness:	10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver, ENEIPIG, Pure gold etc..
Technology:	HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

Main Applications

Radio Frequency: Used in RF devices for reliable signal transmission.
Backpanel and High-Performance Computing: Ideal for complex computing systems.
Line Cards and Storage: Essential components in data storage solutions.
Servers, Telecom, and Base Stations: Supports critical telecommunications infrastructure.
Office Routers: Provides reliable connectivity solutions.

Our Advantages

Certifications: ISO9001, ISO14001, IATF16949, ISO13485, UL Certified.
Workshop Size: 16,000㎡ facility.
Production Capacity: 30,000㎡ output capability per month.
Production Capabilities: From prototype to large volume production.
Quality Standards: IPC Class 2 / IPC Class 3 compliant.
HDI PCBs: Capability to produce any layer high-density interconnect PCBs.
On-Time Delivery: Over 98% delivery rate.
Customer Satisfaction: Complaint rate less than 1%.

Typical Properties (TU-872 SLK Sp)