High-Dk RF PCB DK10, DK22 - Wangling TP High Frequency PCB for Beidou, Missile-Borne, and Miniaturized Antennas
(Note: Printed Circuit Boards are custom-made products. Images and parameters are for reference only.)
Introduction
Wangling's TP High Frequency PCB is a cutting-edge solution in the high-frequency thermoplastic material industry. The dielectric layer of TP-type laminates is composed of a unique blend of ceramics and polyphenylene oxide resin (PPO), without fiberglass reinforcement. This allows for precise adjustment of the dielectric constant by altering the ratio between ceramics and PPO resin. The production process is specialized, ensuring exceptional dielectric performance and high reliability. TP refers to the smooth surface material without copper cladding, TP-1 has copper cladding on one side, and TP-2 has copper cladding on both sides.
Key Features
1.Adjustable Dielectric Constant: The dielectric constant can be customized within a range of 3 to 25, ensuring stability and meeting specific circuit requirements. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, and 20. The dielectric loss is low, with minimal changes up to 10 GHz.
2.Wide Temperature Range: Operates reliably from -100°C to +150°C, with excellent low-temperature resistance. However, temperatures exceeding 180°C may cause material deformation, copper foil peeling, and significant changes in electrical performance.
3.Customizable Thickness: Available in various thicknesses, starting from 0.5mm, with options for customization.
4.Radiation Resistance and Low Outgassing: Ideal for applications requiring high reliability in harsh environments.
5.Ideal for High-Frequency Applications: Perfect for Beidou systems, missile-borne systems, fuzes, and miniaturized antennas.
6.Superior Adhesion and Machinability: The adhesion between copper foil and dielectric is more reliable than ceramic substrates with vacuum coating. The material is easy to machine, allowing for drilling, turning, grinding, shearing, and etching—processes that ceramic substrates cannot handle.
7.Cost-Effective PCB Processing: Suitable for thermoplastic material processing methods, resulting in high yield and reduced costs compared to ceramic substrates. Multilayer PCB processing is generally not recommended, but if required, low-temperature bonding sheets should be used, with careful consideration of feasibility.
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Data Sheet
| Product Technical Parameter | Product Models & Data Sheet | |||||||||||||||
| Product Features | Test Conditions | Unit | TP TP-1 TP-2 | |||||||||||||
| Dielectric Constant | When the dielectric constant is ≤11, the test condition is 10GHz. When the dielectric constant is >11, the test condition is 5GHz. |
/ | 3.0±0.06 | 4.4±0.09 | 6.0±0.12 | |||||||||||
| 6.15±0.12 | 9.2±0.18 | 9.6±0.19 | ||||||||||||||
| 10.2±0.2 | 11.0±0.022 | 16.0±0.4 | ||||||||||||||
| 20.0±0.8 | 22.0±0.88 | 25.0±1.0 | ||||||||||||||
| The dielectric constant can be customized within the range of 3.0 to 25. | ||||||||||||||||
| Dielectric Constant Tolerance | Dielectric Constant 3.0～11.0 | / | ±2% | |||||||||||||
| Dielectric Constant 11.1～16.0 | / | ±2.5% | ||||||||||||||
| Dielectric Constant 16.1～25.0 | / | ±4% | ||||||||||||||
| Loss Tangent | Loss Tangent 3.0～9.5 | 10GHz | / | 0.0010 | ||||||||||||
| Loss Tangent 9.6～11.0 | 10GHz | / | 0.0012 | |||||||||||||
| Loss Tangent 11.1～16.0 | 5GHz | / | 0.0015 | |||||||||||||
| Loss Tangent 16.1～25.0 | 5GHz | / | 0.0020～0.0025 | |||||||||||||
| Dielectric Constant Temperature Coefficient | Dielectric Constant 3.0～9.5 | -55 º~150ºC | PPM/℃ | -50 | ||||||||||||
| Dielectric Constant 9.6～16.0 | -55 º~150ºC | PPM/℃ | -40 | |||||||||||||
| Dielectric Constant 16.1～25.0 | -55 º~150ºC | PPM/℃ | -55 | |||||||||||||
| Peel Strength | 1 OZ Normal State | N/mm | >0.6 | |||||||||||||
| 1 OZ After AC Humidity Test | N/mm | >0.4 | ||||||||||||||
| Volume Resistivity | Normal State at 500V | MΩ.cm | >1×109 | |||||||||||||
| Surface Resistivity | Normal State at 500V | MΩ | >1×107 | |||||||||||||
| Coefficient of Thermal Expansion (XY Z) |
Dielectric Constant 3.00～4.40 | -55 º~150ºC | PPM/℃ | 60,60,70 | ||||||||||||
| Dielectric Constant 4.60～6.15 | -55 º~150ºC | PPM/℃ | 50,50,60 | |||||||||||||
| Dielectric Constant 6.16～11.0 | -55 º~150ºC | PPM/℃ | 40,40,55 | |||||||||||||
| Dielectric Constant 11.1～16.0 | -55 º~150ºC | PPM/℃ | 40,40,50 | |||||||||||||
| Dielectric Constant 16.1～25.0 | -55 º~150ºC | PPM/℃ | 35,35,40 | |||||||||||||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.01 | |||||||||||||
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -100º~150ºC | |||||||||||||
| Material Composition | Polyphenylene ether, ceramic, paired with ED copper foil. | |||||||||||||||
| The density and thermal conductivity data for materials with different dielectric constants are as follows: | ||||||||||||||||
| Product Features | Unit | Dielectric Constanct | ||||||||||||||
| 3.0 | 4.4 | 6.0 | 6.15 | 9.6 | 10.2 | 11.0 | 16.0 | 20.0 | 22.0 | 25.0 | ||||||
| Density | g/cm3 | 1.69 | 1.89 | 2.1 | 2.12 | 2.26 | 2.33 | 2.40 | 2.76 | 2.73 | 2.77 | 2.94 | ||||
| Thermal Conductivity | W/(M.K) | 0.40 | 0.44 | 0.55 | 0.55 | 0.65 | 0.67 | 0.70 | 0.80 | 0.85 | 0.90 | 1.0 | ||||
Our PCB Capabilities (TP Series)
| PCB Capability (TP Series) | |||
| PCB Material: | Polyphenylene ether, ceramic | ||
| Designation (TP Series) | Designation | DK | DF |
| TP300 | 3.0±0.06 | 0.0010 | |
| TP440 | 4.4±0.09 | 0.0010 | |
| TP600 | 6.0±0.12 | 0.0010 | |
| TP615 | 6.15±0.12 | 0.0010 | |
| TP920 | 9.2±0.18 | 0.0010 | |
| TP960 | 9.6±0.2 | 0.0011 | |
| TP1020 | 10.2±0.2 | 0.0011 | |
| TP1100 | 11.0±0.22 | 0.0011 | |
| TP1600 | 16.0±0.32 | 0.0015 | |
| TP2000 | 20.0±0.4 | 0.0020 | |
| TP2200 | 22.0±0.44 | 0.0022 | |
| TP2500 | 25.0±0.5 | 0.0025 | |
| Layer count: | Single Sided, Double Sided PCB | ||
| Copper weight: | 1oz (35µm), 2oz (70µm) | ||
| Dielectric thickness (Dielectric thickness or overall thickness) | 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, 12.0mm | ||
| PCB size: | ≤150mm X 220mm | ||
| Solder mask: | Green, Black, Blue, Yellow, Red etc. | ||
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. | ||
TP PCB Applications
Shown here is a 1.5mm TP high-frequency PCB with OSP (Organic Solderability Preservative) coating. TP high-frequency PCBs are widely used in advanced applications such as Beidou systems, missile-borne systems, fuzes, and miniaturized antennas.
Important Considerations
This material is not suitable for 260°C thermal shock testing and cannot be wave soldered. Hand soldering with a constant temperature soldering iron is recommended. Reflow soldering is generally not advised, but if necessary, the maximum temperature should not exceed 200°C, with thorough consideration of feasibility and stability.