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High Frequency PCB Rogers RO4350B 20mil 0.508mm Double Sided RF PCB for Splitter

(Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only)


RO4350B hydrocarbon ceramic laminates are engineered to deliver exceptional high-frequency performance and cost-effective circuit fabrication. The options for laminates available to designers significantly decrease when operational frequencies reach 500 MHz and above. RO4350B material possesses the essential characteristics sought by designers of RF microwave circuits, matching networks, and controlled impedance transmission lines. Its low dielectric loss enables RO4350B to be utilized in various applications where conventional circuit board materials are unsuitable due to higher operating frequencies.



The temperature coefficient of dielectric constant for RO4350B is one of the lowest among circuit board materials, and its dielectric constant remains stable across a wide frequency spectrum. The thermal coefficient of expansion (CTE) of RO4350B offers several significant advantages for PCB designers. Its expansion coefficient closely matches that of copper, ensuring excellent dimensional stability—an essential feature for constructing mixed dielectric multilayer boards. Additionally, the low Z-axis CTE of RO4350B guarantees reliable plated through-hole quality, even under severe thermal shock conditions. With a Tg exceeding 280°C, the expansion characteristics of RO4350B remain consistent throughout the full range of PCB processing temperatures.


PCB Specifications

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High Frequency PCB Rogers 20mil 0.508mm RO4350B Double Sided RF PCB for Splitter

PCB SIZE

26 x 83mm=1PCS

BOARD TYPE

 

Number of Layers

Double sided PCB, 2 Layer PCB

Surface Mount Components

YES

Through Hole Components

no

LAYER STACKUP

copper ------- 35um(1oz)+plate TOP layer

RO4350B 20mil (0.508mm)

copper ------- 35um(1oz)+plate BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

5.98mil/6.18mil

Minimum / Maximum Holes:

0.3/3.2mm

Number of Different Holes:

5

Number of Drill Holes:

431

Number of Milled Slots:

0

Number of Internal Cutouts:

no

Impedance Control

no

BOARD MATERIAL

 

Glass Epoxy:

RO4350B 20mil (0.508mm), Tg 288℃

Final foil external:

1.5oz

Final foil internal:

0oz

Final height of PCB:

0.6mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion Gold (81.1%) 2µ" over 100µ" nickel

Solder Mask Apply To:

Top and Bottom, 12micron Minimum

Solder Mask Color:

Green, LP-4G G-05, Nanya supplied

Solder Mask Type:

LPSM

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

TOP

Colour of Component Legend

White, S-380W, Taiyo Supplied.

Manufacturer Name or Logo:

Marked on the board in a conductor and leged FREE AREA

VIA

Plated Through Hole(PTH)

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059" (0.15mm)

Board plating:

0.0030" (0.076mm)

Drill tolerance:

0.002" (0.05mm)

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.


Typical Applications:

Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power Amplifiers
RFID


Data Sheet of Rogers 4350B (RO4350B)

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RO4350B Typical Value

Property

RO4350B

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

3.48±0.05

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

3.66

Z

 

8 to 40 GHz

Differential Phase Length Method

Dissipation Factortan,δ

0.0037
0.0031

Z

 

10 GHz/23℃
2.5 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

+50

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

1.2 x 1010

 

MΩ.cm

COND A

IPC-TM-650 2.5.17.1

Surface Resistivity

5.7 x109

 

MΩ

COND A

IPC-TM-650 2.5.17.1

Electrical Strength

31.2(780)

Z

Kv/mm(v/mil)

0.51mm(0.020")

IPC-TM-650 2.5.6.2

Tensile Modulus

16,767(2,432)
14,153(2,053)

X
Y

MPa(ksi)

RT

ASTM D 638

Tensile Strength

203(29.5)
130(18.9)

X
Y

MPa(ksi)

RT

ASTM D 638

Flexural Strength

255
(37)

 

MPa
(kpsi)

 

IPC-TM-650 2.4.4

Dimensional Stability

<0.5

X,Y

mm/m
(mil/inch)

after etch+E2/150℃

IPC-TM-650 2.4.39A

Coefficient of Thermal Expansion

10
12
32

X
Y
Z

ppm/℃

-55℃to288℃

IPC-TM-650 2.4.41

Tg

>280

 

℃ TMA

A

IPC-TM-650 2.4.24.3

Td

390

 

℃ TGA

 

ASTM D 3850

Thermal Conductivity

0.69

 

W/M/oK

80℃

ASTM C518

Moisture Absorption

0.06

 

%

48hrs immersion 0.060"
sample Temperature 50℃

ASTM D 570

Density

1.86

 

gm/cm3

23℃

ASTM D 792

Copper Peel Stength

0.88
(5.0)

 

N/mm
(pli)

after solder float 1 oz.
EDC Foil

IPC-TM-650 2.4.8

Flammability

(3)V-0

 

 

 

UL 94

Lead-free Process Compatible

Yes

 

 

 


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