High-Frequency PCB: RO4350B 10mil (0.254mm) Double-Sided RF PCB for LTE Applications
(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
RO4350B hydrocarbon ceramic laminates are engineered for exceptional high-frequency performance while maintaining cost-effective circuit fabrication. When operational frequencies reach 500 MHz and above, the selection of available laminates for designers significantly narrows. The RO4350B material possesses essential attributes for RF microwave circuit design, matching networks, and controlled impedance transmission lines. Its low dielectric loss makes RO4350B suitable for numerous applications where traditional circuit board materials are limited by higher operating frequencies.
This material boasts one of the lowest temperature coefficients of dielectric constant among circuit board materials, ensuring stability across a wide frequency range. The thermal coefficient of expansion (CTE) of RO4350B provides several advantages for PCB designers. Its expansion coefficient closely matches that of copper, resulting in excellent dimensional stability—crucial for mixed dielectric multi-layer board constructions. The low Z-axis CTE of RO4350B guarantees reliable plated through-hole quality, even under severe thermal stress. With a glass transition temperature (Tg) exceeding 280°C, RO4350B maintains stable expansion characteristics throughout all PCB processing temperatures.
Specifications for a 0.3mm RO4350B PCB
High Frequency PCB Rogers 10mil 0.254mm RO4350B Double Sided RF PCB for LTE |
|
PCB SIZE |
30 x 80mm=1up |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 35um(1 oz)+plate TOP layer |
RO4350B 0.254mm |
|
copper ------- 35um(1oz) + plate BOT Layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
N/A |
Minimum / Maximum Holes: |
N/A |
Number of Different Holes: |
N/A |
Number of Drill Holes: |
0 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
RO4350B Tg280℃, er<3.48, Rogers Corp. |
Final foil external: |
1.5 oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.3 mm ±0.1 |
PLATING AND COATING |
|
Surface Finish |
Immersion gold, 16% |
Solder Mask Apply To: |
N/A |
Solder Mask Color: |
N/A |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
NO |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
Common Applications:
Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power Amplifiers
RFID Technology
Data Sheet of Rogers 4350B (RO4350B)
RO4350B Typical Value |
|||||
Property |
RO4350B |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.48±0.05 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3.66 |
Z |
|
8 to 40 GHz |
Differential Phase Length Method |
Dissipation Factortan,δ |
0.0037 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
+50 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
1.2 x 1010 |
|
MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
5.7 x109 |
|
MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
31.2(780) |
Z |
Kv/mm(v/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
Tensile Modulus |
16,767(2,432) |
X |
MPa(ksi) |
RT |
ASTM D 638 |
Tensile Strength |
203(29.5) |
X |
MPa(ksi) |
RT |
ASTM D 638 |
Flexural Strength |
255 |
|
MPa |
|
IPC-TM-650 2.4.4 |
Dimensional Stability |
<0.5 |
X,Y |
mm/m |
after etch+E2/150℃ |
IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion |
10 |
X |
ppm/℃ |
-55℃to288℃ |
IPC-TM-650 2.4.41 |
Tg |
>280 |
|
℃ TMA |
A |
IPC-TM-650 2.4.24.3 |
Td |
390 |
|
℃ TGA |
|
ASTM D 3850 |
Thermal Conductivity |
0.69 |
|
W/M/oK |
80℃ |
ASTM C518 |
Moisture Absorption |
0.06 |
|
% |
48hrs immersion 0.060" |
ASTM D 570 |
Density |
1.86 |
|
gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
0.88 |
|
N/mm |
after solder float 1 oz. |
IPC-TM-650 2.4.8 |
Flammability |
(3)V-0 |
|
|
|
UL 94 |
Lead-free Process Compatible |
Yes |
|
|
|
|