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High Frequency PCB Rogers RO4350B 30mil 0.762mm Double-Sided RF Circuit Board for LNCs

(Printed Circuit Boards are custom-made products; the images and parameters provided are for reference only)


Brief Introduction of RO4350B

RO4350B hydrocarbon ceramic laminates are engineered to provide exceptional high-frequency performance and cost-effective circuit fabrication. As operational frequencies rise above 500 MHz, the range of laminates available to designers becomes significantly limited. RO4350B material offers the necessary properties for designing RF microwave circuits, matching networks, and controlled impedance transmission lines. Its low dielectric loss enables RO4350B to be utilized in numerous applications where traditional circuit board materials are insufficient due to higher operating frequencies.



The temperature coefficient of dielectric constant for RO4350B is among the lowest of all circuit board materials, ensuring that the dielectric constant remains stable across a wide frequency range. Additionally, the thermal coefficient of expansion (CTE) of RO4350B provides several advantages for PCB designers. The expansion coefficient of RO4350B closely matches that of copper, which ensures excellent dimensional stability—an essential property for constructing mixed dielectric multilayer boards. The low Z-axis CTE of RO4350B guarantees reliable plated through-hole quality, even under severe thermal shock conditions. With a Tg of over 280°C, RO4350B maintains stable expansion characteristics throughout the entire range of PCB processing temperatures.


PCB Specifications

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High Frequency PCB Rogers 30mil 0.762mm RO4350B Double Sided RF Circuit Board for LNCs

PCB SIZE

93 x 92mm=1PCS

BOARD TYPE

 

Number of Layers

Double sided PCB, 2 Layer PCB

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 17.8um(0.5oz)+plate TOP layer

RO4350B 30mil (0.762mm)

copper ------- 17.8um(1oz)+plate BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

11.97mil

Minimum / Maximum Holes:

0.3/2.8mm

Number of Different Holes:

2

Number of Drill Holes:

195

Number of Milled Slots:

5

Number of Internal Cutouts:

0

Impedance Control

No

BOARD MATERIAL

 

Glass Epoxy:

RO4350B 30mil (0.762mm), Tg 288℃

Final foil external:

1oz

Final foil internal:

0oz

Final height of PCB:

0.8mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion Gold (16.2%) 2 micoinch over 100 microinch nickel

Solder Mask Apply To:

NO

Solder Mask Color:

NO

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing, Fiducial Marks

MARKING

 

Side of Component Legend

NO

Colour of Component Legend

NO

Manufacturer Name or Logo:

N/A

VIA

Plated Through Hole(PTH)

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059" (0.15mm)

Board plating:

0.0030" (0.076mm)

Drill tolerance:

0.002" (0.05mm)

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.


Typical applications include:

Automotive Radar and Sensors

Cellular Base Station Antennas

Direct Broadcast Satellites

Low Noise Block

Power Amplifiers

RFID


Data Sheet for Rogers 4350 (RO4350B)

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RO4350B Typical Value

Property

RO4350B

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

3.48±0.05

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

3.66

Z

 

8 to 40 GHz

Differential Phase Length Method

Dissipation Factortan,δ

0.0037
0.0031

Z

 

10 GHz/23℃
2.5 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

+50

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

1.2 x 1010

 

MΩ.cm

COND A

IPC-TM-650 2.5.17.1

Surface Resistivity

5.7 x109

 

MΩ

COND A

IPC-TM-650 2.5.17.1

Electrical Strength

31.2(780)

Z

Kv/mm(v/mil)

0.51mm(0.020")

IPC-TM-650 2.5.6.2

Tensile Modulus

16,767(2,432)
14,153(2,053)

X
Y

MPa(ksi)

RT

ASTM D 638

Tensile Strength

203(29.5)
130(18.9)

X
Y

MPa(ksi)

RT

ASTM D 638

Flexural Strength

255
(37)

 

MPa
(kpsi)

 

IPC-TM-650 2.4.4

Dimensional Stability

<0.5

X,Y

mm/m
(mil/inch)

after etch+E2/150℃

IPC-TM-650 2.4.39A

Coefficient of Thermal Expansion

10
12
32

X
Y
Z

ppm/℃

-55℃to288℃

IPC-TM-650 2.4.41

Tg

>280

 

℃ TMA

A

IPC-TM-650 2.4.24.3

Td

390

 

℃ TGA

 

ASTM D 3850

Thermal Conductivity

0.69

 

W/M/oK

80℃

ASTM C518

Moisture Absorption

0.06

 

%

48hrs immersion 0.060"
sample Temperature 50℃

ASTM D 570

Density

1.86

 

gm/cm3

23℃

ASTM D 792

Copper Peel Stength

0.88
(5.0)

 

N/mm
(pli)

after solder float 1 oz.
EDC Foil

IPC-TM-650 2.4.8

Flammability

(3)V-0

 

 

 

UL 94

Lead-free Process Compatible

Yes