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Rogers RO4003 32mil 0.813mm PCB Double Sided RF High Frequency PCB for Filters

(Printed Circuit Boards (PCBs) are tailored products; the images and specifications provided are for reference only.)


Product Overview

Looking for premium RF PCB materials? The Rogers RO4003C 32mil (0.813mm) double-sided PCB delivers exceptional high-frequency performance for RF and microwave applications. Custom manufacturing available to meet your specific requirements.


Key Features of Rogers RO4003C PCB Material

1.Superior RF Performance: Ideal for frequencies above 500 MHz
2.Low Dielectric Loss: Perfect for high-frequency applications
3.Temperature Stable: Features one of the lowest dielectric constant temperature coefficients
4.Excellent Dimensional Stability: CTE matched to copper
5.High Glass Transition Temperature: Tg >280°C for reliable processing
6.Through-Hole Quality: Low Z-axis CTE ensures durability


Why Choose Rogers RO4003C?

.Cost-Effective: Premium performance at competitive prices
.Manufacturing Flexibility: Suitable for standard PCB fabrication processes
.Reliability: Excellent thermal shock resistance
.Frequency Stability: Consistent performance across broad frequency ranges
.Multi-Layer Capability: Ideal for mixed dielectric constructions


Technical Specifications

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High Frequency PCB Rogers 32mil 0.813mm RO4003C Double Sided RF PCB for Filters

PCB SIZE

98 x 72mm=1PCS

BOARD TYPE

 

Number of Layers

Double sided PCB

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 35um(1oz)+PLATE

RO4003C 32 mil 0.813mm

copper ------- 35um(1oz)+PLATE

TECHNOLOGY

 

Minimum Trace and Space:

6.98mil/6.28mil

Minimum / Maximum Holes:

0.3/1.2mm

Number of Different Holes:

5

Number of Drill Holes:

481

Number of Milled Slots:

0

Number of Internal Cutouts:

1

Impedance Control

no

BOARD MATERIAL

 

Glass Epoxy:

RO4003C 32 mil (0.813mm), Tg 288℃

Final foil external:

1.5oz

Final foil internal:

0oz

Final height of PCB:

0.9 mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion Gold

Solder Mask Apply To:

NO

Solder Mask Color:

NO

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

NO

Colour of Component Legend

NO

Manufacturer Name or Logo:

N/A

VIA

Plated Through Hole(PTH)

FLAMIBILITY RATING

N/A

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059" (0.15mm)

Board plating:

0.0030" (0.076mm)

Drill tolerance:

0.002" (0.05mm)

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.


Applications

1.Automotive
Radar systems
Sensor applications


2.Telecommunications
Cellular base station antennas
RF power amplifiers


3.Satellite Communications
Direct broadcast satellites
Low noise block components


4. Wireless
RFID systems
High-frequency communications



Data Sheet for Rogers 4003C (RO4003C)

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RO4003C Typical Value

Property

RO4003C

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

3.38±0.05

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

3.55

Z

 

8 to 40 GHz

Differential Phase Length Method

Dissipation Factortan,δ

0.0027
0.0021

Z

 

10 GHz/23℃
2.5 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

+40

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

1.7 x 1010

 

MΩ.cm

COND A

IPC-TM-650 2.5.17.1

Surface Resistivity

4.2 x 109

 

MΩ

COND A

IPC-TM-650 2.5.17.1

Electrical Strength

31.2(780)

Z

Kv/mm(v/mil)

0.51mm(0.020")

IPC-TM-650 2.5.6.2

Tensile Modulus

19,650(2,850)
19,450(2,821)

X
Y

MPa(ksi)

RT

ASTM D 638

Tensile Strength

139(20.2)
100(14.5)

X
Y

MPa(ksi)

RT

ASTM D 638

Flexural Strength

276
(40)

 

MPa
(kpsi)

 

IPC-TM-650 2.4.4

Dimensional Stability

<0.3

X,Y

mm/m
(mil/inch)

after etch+E2/150℃

IPC-TM-650 2.4.39A

Coefficient of Thermal Expansion

11
14
46

X
Y
Z

ppm/℃

-55℃to288℃

IPC-TM-650 2.4.41

Tg

>280

 

℃ TMA

A

IPC-TM-650 2.4.24.3

Td

425

 

℃ TGA

 

ASTM D 3850

Thermal Conductivity

0.71

 

W/M/oK

80℃

ASTM C518

Moisture Absorption

0.06

 

%

48hrs immersion 0.060"
sample Temperature 50℃

ASTM D 570

Density

1.79

 

gm/cm3

23℃

ASTM D 792

Copper Peel Stength

1.05
(6.0)

 

N/mm
(pli)

after solder float 1 oz.
EDC Foil

IPC-TM-650 2.4.8

Flammability

N/A

 

 

 

UL 94

Lead-free Process Compatible

Yes

 

 

 




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