Home > Multi-layer PCB > 4 Layer High Frequency PCB on 2 Cores of 32mil RO4003C and 12mil RO4450F for Ultrahigh Frequency Couplers
4 Layer High Frequency PCB on 2 Cores of 32mil RO4003C and 12mil RO4450F for Ultrahigh Frequency Couplers

(Printed circuit boards are custom-made products; the images and specifications shown are for reference only.)


Introduction

Hello Everyone,
Good day!
Today, we will discuss a specialized 4 layer high frequency PCB. This PCB is constructed using two sheets of 0.813mm (32mil) RO4003C cores, combined with one sheet of RO4450F prepreg, specifically designed for ultrahigh frequency coupler applications. Below is the stack-up configuration.


Typically, multilayer Rogers high-frequency PCBs are composed entirely of high-frequency materials, including prepreg adhesives. The RO4003C family features six core thickness options, ranging from 8mil (0.203mm) to 60mil (1.524mm).


RO4003C Thickness

Metric

8mil

0.203mm

12mil

0.305mm

16mil

0.406mm

20mil

0.508mm

32mil

0.813mm

60mil

1.524mm

The stack-up of four layers can be configured in various ways, providing design flexibility.


Specifications of the Board:

Item Specification
Base Material RO4003C 32mil + RO4450F 12mil Prepreg
Layer Count 4 Layers
Type Castellation holes (half holes) on the edge
Format 113mm x 80mm = 1 type = 4 pieces
Surface Finish Immersion gold
Copper Weight Outer layer 35 μm / Inner layer 35 μm
Solder Mask / Legend None / None
Final PCB Height 2.1 mm
Standard IPC 6012 Class 2
Packing 20 panels per shipment
Lead Time 10 working days
Shelf Life 6 months

Features and Benefits:

1.Outstanding High-Frequency Performance: Achieved through low dielectric tolerance and loss.
2.Automated Optical Inspection (AOI): Ensures quality control.
3.Comprehensive PCB Solutions: From prototype development to mass production.
4.Production Capacity: Capable of processing 30,000 square meters monthly.
5.Diverse PCB Types: Ability to produce 8,000 different PCB designs each month.
6.Extensive Experience: Over 16 years in the PCB manufacturing industry.


Applications

GPS Antennas
WiFi Amplifiers
Power Amplifiers
RF Transceivers
TV Antennas
Radar Data Acquisition Converters
Spread Spectrum Devices
Attenuators



Appendix: Properties of RO4003C

Click to expand/collapse the table

RO4003C Typical Value

Property

RO4003C

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

3.38±0.05

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

3.55

Z

 

8 to 40 GHz

Differential Phase Length Method

Dissipation Factortan,δ

0.0027
0.0021

Z

 

10 GHz/23℃
2.5 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

+40

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

1.7 x 1010

 

MΩ.cm

COND A

IPC-TM-650 2.5.17.1

Surface Resistivity

4.2 x 109

 

COND A

IPC-TM-650 2.5.17.1

Electrical Strength

31.2(780)

Z

Kv/mm(v/mil)

0.51mm(0.020")

IPC-TM-650 2.5.6.2

Tensile Modulus

19,650(2,850)
19,450(2,821)

X
Y

MPa(ksi)

RT

ASTM D 638

Tensile Strength

139(20.2)
100(14.5)

X
Y

MPa(ksi)

RT

ASTM D 638

Flexural Strength

276
(40)

 

MPa
(kpsi)

 

IPC-TM-650 2.4.4

Dimensional Stability

<0.3

X,Y

mm/m
(mil/inch)

after etch+E2/150℃

IPC-TM-650 2.4.39A

Coefficient of Thermal Expansion

11
14
46

X
Y
Z

ppm/℃

-55℃to288℃

IPC-TM-650 2.4.41

Tg

>280

 

℃ TMA

A

IPC-TM-650 2.4.24.3

Td

425

 

℃ TGA

 

ASTM D 3850

Thermal Conductivity

0.71

 

W/M/oK

80℃

ASTM C518

Moisture Absorption

0.06

 

%

48hrs immersion 0.060"
sample Temperature 50℃

ASTM D 570

Density

1.79

 

gm/cm3

23℃

ASTM D 792

Copper Peel Stength

1.05
(6.0)

 

N/mm
(pli)

after solder float 1 oz.
EDC Foil

IPC-TM-650 2.4.8

Flammability

N/A

 

 

 

UL 94

Lead-free Process Compatible

Yes

 

 

 




Next 6 Layer High Frequency PCB Built on 3 Cores of 20mil RO4003C and 4mil RO4450F for Radar Altimeter