Advanced 6-Layer Hybrid PCBs with RO4003C and FR-4 for High-Frequency Applications

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)

Introduction of RO4003C

Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics that combine the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. These laminates provide tight control over the dielectric constant (Dk) and exhibit low loss, utilizing standard epoxy/glass processing methods at a fraction of the cost of conventional microwave laminates. Unlike PTFE-based materials, RO4003C does not require special through-hole treatments or handling procedures.

RO4003C materials are non-brominated and are not rated UL 94 V-0.

Features of RO4003C

Dielectric Constant: DK 3.38 ± 0.05 at 10GHz
Dissipation Factor: 0.0027 at 10GHz
Thermal Conductivity: 0.71 W/m/°K
Thermal Coefficient of Dielectric Constant: +40 ppm/°C (ranging -50°C to 150°C)
CTE Matched to Copper: X-axis 11 ppm/°C, Y-axis 14 ppm/°C
Low Z-axis CTE: 46 ppm/°C
Tg: >280°C
Low Moisture Absorption: 0.06%

Basic PCB Specifications

Specification	Details
Base Material	RO4003C and FR-4 mixed
Layer Count	6 layers
Board Dimensions	83.50mm x 66mm (1 PCS), ± 0.15mm
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.2mm
Blind and Buried Vias	Top layer to inner layer 1 (L2), inner layer 2 to inner layer 3 (L3-L4)
Finished Board Thickness	1.1mm
Finished Copper Weight	1oz (1.4 mils) inner/outer layers
Via Plating Thickness	20 µm
Surface Finish	Immersion Gold
Top Silkscreen	White
Bottom Silkscreen	No
Top Solder Mask	Matt Green
Bottom Solder Mask	Matt Green
Impedance Control	50 ohm on 4mil / 4mil traces/gaps, top layer
Print Series Number	Included
Via Filling	0.2mm vias filled and capped
Electrical Testing	100% electrical test prior to shipment

PCB Stack-Up (6-Layer Rigid PCB)

Layer	Material	Thickness
Copper Layer 1	Copper	35 µm
Copper Layer 2	RO4003C	0.305 mm (12 mil)
Copper Layer 3	Copper	35 µm
Prepreg Bondply	1080 RC63%	0.0644 mm (2.5 mil)
Copper Layer 4	Copper	35 µm
FR-4	Core	0.076 - 0.203 mm (3 mil)
Copper Layer 5	Copper	35 µm
Prepreg Bondply	1080 RC63%	0.0644 mm (2.5 mil)
Copper Layer 6	Copper	35 µm
RO4003C	Core	0.305 mm (12 mil)

PCB Statistics

Components: 51
Total Pads: 82
Through Hole Pads: 53
Top SMT Pads: 29
Bottom SMT Pads: 0
Vias: 49
Nets: 6

Artwork and Standards Information

Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide

Typical Applications

Commercial airline broadband antennas
Microstrip and stripline circuits
Millimeter wave applications
Radar systems
Guidance systems
Point-to-point digital radio antennas