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AGC RF-10 2-Layer ENEPIG PCB
PCB Material:AGC RF-10 (Ceramic-filled PTFE) / 0.5mm
MOQ:1PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-10 working days
Payment Method:T/T, Paypal
 

AGC RF-10 2-Layer 0.5mm ENEPIG PCB – Microstrip Patch & GPS Antenna


1. Introduction to AGC RF-10 PCB

AGC RF-10 copper clad laminates are composites of ceramic-filled PTFE and woven fiberglass, engineered for high-power RF applications. RF-10 offers the advantage of a high dielectric constant (Dk) and low dissipation factor, enabling significant size reduction in RF circuits. The thin woven fiberglass reinforcement provides both low dielectric loss and improved rigidity, facilitating ease of handling and enhanced dimensional stability for multilayer circuits.


AGC RF-10 laminates are designed to provide a cost-effective substrate with industry-acceptable delivery times. They bond well to smooth, low-profile copper, and the combination of low dissipation factor and very smooth copper results in optimal insertion losses at higher frequencies where skin effect losses are substantial.


This 2-layer rigid PCB is constructed entirely with AGC RF-10 as the core material, making it ideal for demanding RF antenna and passive component applications.


2L RF-10 PCB 10mil ENEPIG


2. Key Features of AGC RF-10 PCB

High dielectric constant (Dk = 10.2 ± 0.3 at 10 GHz)

Low dissipation factor (Df = 0.0025 at 10 GHz)

High thermal conductivity (0.85 W/m·K, unclad)

Low moisture absorption (0.08%)

X-axis CTE: 16 ppm/°C, Y-axis CTE: 20 ppm/°C, Z-axis CTE: 25 ppm/°C

Flammability rating: UL 94 V-0


3. Benefits of AGC RF-10 PCB

High Dk enables RF circuit size reduction

Excellent dimensional stability

Tight Dk tolerance (±0.3)

High thermal conductivity for enhanced thermal management

Excellent adhesion to smooth copper foils

Low X, Y, Z expansion for plated through-hole reliability

Excellent price/performance ratio


4.AGC RF-10 PCB Construction Details

ItemSpecification
Base material AGC RF-10
Layer count Double sided
Board dimensions 143.6mm x 109.8mm = 2 Types = 2 PCS, ±0.15mm
Minimum Trace / Space 5 / 7 mils
Minimum Hole Size 0.4mm
Blind vias No
Finished board thickness 0.5mm
Finished Cu weight 1 oz (1.4 mils) outer layers
Via plating thickness20 μm
Surface finishENEPIG
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
100% Electrical testUsed prior to shipment

5. PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35μm (1oz)

RF-10 Core - 10mil (0.254mm)

Copper_layer_2 - 35μm (1oz)


6. PCB Statistics

Components: 24

Total Pads: 51

Thru Hole Pads: 34

Top SMT Pads: 17

Bottom SMT Pads: 0

Vias: 29

Nets: 2


7. Primary Application Areas

Microstrip patch antennas

GPS antennas

Passive components (filters, couplers, power dividers)

Aircraft collision avoidance systems

Satellite components


8.Quality Assurance

Type of artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-3
Availability: Worldwide


9. AGC RF-10 Low-Loss Ceramic-Filled PTFE – Product Introduction

AGC RF-10 laminates are ceramic-filled PTFE composites reinforced with woven fiberglass. They are optimized for high-frequency, high-power RF applications requiring high dielectric constant and low signal loss. The thin woven glass reinforcement ensures mechanical rigidity and dimensional stability, while the ceramic filler provides a stable Dk and low dissipation factor.


AGC RF-10 can be sheared, drilled, milled, and plated using standard PTFE circuit board processing techniques. Its low Z-axis expansion enhances plated through-hole reliability and reduces scaling factors for artwork compensation.


CCL 133 RF-10


10.Features and Benefits Summary

Key FeaturesBenefits
Dk = 10.2 ± 0.3 @ 10 GHzRF circuit size reduction
Df = 0.0025 @ 10 GHzLow insertion loss at high frequencies
Thermal conductivity = 0.85 W/m·KEnhanced thermal management
CTE: X=16, Y=20, Z=25 ppm/°CExcellent dimensional & PTH reliability
Moisture absorption = 0.08%Stable performance in humid environments
UL 94 V-0Flame retardant

11.AGC RF-10 Data Sheet

PropertyTest MethodUnitAGC RF-10 Typical Value
Dielectric Constant (10 GHz)IPC-650 2.5.5.5.1 Mod.10.2 ± 0.3
Dissipation Factor (10 GHz)IPC-650 2.5.5.5.1 Mod.0.0025
Surface ResistivityIPC-650 2.5.17.1Mohms1.0 × 10⁸
Volume ResistivityIPC-650 2.5.17.1Mohms·cm6.0 × 10⁷
Thermal Conductivity (Unclad)IPC-650 2.4.50W/m·K0.85
CTE (X, RT–150°C)IPC-650 2.4.41ppm/°C16
CTE (Y, RT–150°C)IPC-650 2.4.41ppm/°C20
CTE (Z, RT–150°C)IPC-650 2.4.41ppm/°C25
TcK (–55 to 150°C)IPC-650 2.5.5.6ppm/°C–370
Flexural Strength (MD)IPC-650 2.4.4N/mm² (psi)96.53 (14,000)
Flexural Strength (CD)IPC-650 2.4.4N/mm² (psi)68.95 (10,000)
Tensile Strength (MD)IPC-650 2.4.19N/mm² (psi)62.57 (8,900)
Tensile Strength (CD)IPC-650 2.4.19N/mm² (psi)37.26 (5,300)
Moisture AbsorptionIPC-650 2.6.2.1%0.08
Peel Strength (1 oz Cu)IPC-650 2.4.8N/mm1.7
DensityIPC-650 2.3.5g/cm³2.77
Specific HeatIPC-650 2.4.50J/g·°C0.90
Flammability RatingInternal / UL 94ClassV-0

12.Some Typical Applications

Microstrip patch antennas
GPS antennas
Passive components (filters, couplers, power dividers)
Aircraft collision avoidance systems
Satellite components


13. Standard Thicknesses, Panel Sizes & Claddings

Standard Thicknesses (Available)

Inchesmm
0.0100.25
0.0200.51
0.0250.64
0.0601.52
0.1002.54
0.1253.18

Available Sheet Sizes

Inchesmm
12 x 18305 x 457
16 x 18406 x 457
18 x 24457 x 610
36 x 48914 x 1,220

 

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