Advanced 2-Layer RT/duroid 6002 PCBs for Microwave and RF Applications with Immersion Tin Finish
1. Introduction to RT/duroid 6002
Rogers RT/duroid 6002 laminates are ceramic-filled PTFE microwave materials designed for complex microwave structures. These low-loss materials deliver excellent high-frequency performance, showcasing superior mechanical and electrical properties. RT/duroid 6002 is reliable for use in multi-layer board constructions, making it ideal for demanding applications.
2. Key Features of RT/duroid 6002:
Dielectric Constant (Dk): 2.94 ± 0.04
Low Thermal Coefficient of Dk: 12 ppm/°C
Dissipation Factor: 0.0012 at 10 GHz
Thermal Decomposition Temperature (Td): 500 °C (TGA)
Thermal Conductivity: 0.6 W/m/K
Low Z-axis Coefficient of Thermal Expansion: 24 ppm/°C
Moisture Absorption: 0.02%
3. PCB Construction Details:
| Specification | Details |
|---|---|
| Base Material | RT/duroid 6002 |
| Layer Count | 2 layers |
| Board Dimensions | 390mm x 310.9mm (1 PCS) |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.2mm |
| Blind Vias | None |
| Finished Board Thickness | 0.2mm |
| Finished Copper Weight | 1 oz (1.4 mils) for outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Tin |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Testing | 100% Electrical Testing conducted prior to shipment |
4. PCB Stackup
| Layer | Material | Thickness |
|---|---|---|
| Copper Layer 1 | Copper | 35 μm |
| Substrate | RT/duroid 6002 | 5 mil (0.127 mm) |
| Copper Layer 2 | Copper | 35 μm |
5.PCB Statistics
Components: 72
Total Pads: 313
Through Hole Pads: 215
Top SMT Pads: 98
Bottom SMT Pads: 0
Vias: 171
Nets: 2
6.Manufacturing & Compliance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2 compliant
Availability: Worldwide production and shipping
7.Benefits
Low loss for superior high-frequency performance
Tight thickness control for precision applications
In-plane expansion coefficient matched to copper, ideal for temperature-sensitive applications
Low out-gassing, making it suitable for space applications
Excellent dimensional stability
Reliable mechanical and electrical properties for multi-layer board constructions
8.Typical Applications
Phased Array Antennas
Ground-Based and Airborne Radar Systems
Global Positioning System Antennas
Power Backplanes
Commercial Airline Collision Avoidance Systems
Beam Forming Networks