High-Performance RO4360G2 2-Layer PCB for Telecommunications and Power Applications
1. Introduction to RO4360G2
The RO4360G2 laminate is a low-loss, glass-reinforced, hydrocarbon ceramic-filled thermoset material that offers an optimal balance of performance and processing capability. As the first high dielectric constant (Dk) thermoset laminate that can be processed similarly to conventional FR-4, RO4360G2 provides enhanced rigidity for improved processability in multi-layer board constructions. This material is lead-free process capable and helps reduce both material and fabrication costs. It can be effectively paired with RO440 series prepreg and lower-Dk RO4000 laminates in multi-layer designs.
2. Features and Benefits
Features
Dielectric Constant: 6.15 ± 0.15 at 10 GHz and 23°C.
Dissipation Factor: 0.0038 at 10 GHz and 23°C.
Thermal Properties: Td > 407°C; high Tg greater than 280°C (TMA).
Thermal Conductivity: High at 0.75 W/mK.
Low Z-axis CTE: 28 ppm/°C.
Copper-Matched CTE: X-axis: 13 ppm/°C, Y-axis: 14 ppm/°C.
Lead-Free Process Compatibility: 94V-0 flammability rating.
Benefits
Design Flexibility: Allows for versatile applications in various circuit designs.
Plated Through-Hole Reliability: Ensures dependable connections.
Automated Assembly Compatibility: Facilitates efficient manufacturing processes.
Environmentally Friendly: Fully compatible with lead-free processes.
Cost-Effective: Efficient supply chain and short lead times reduce overall material costs.
3. PCB Construction Details
| Base Material | RO4360G2 |
| Layer Count | 2 layers |
| Board Dimensions | 76.32 mm x 67.51 mm (1 piece) |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.20 mm |
| Blind Vias | None |
| Finished Board Thickness | 0.3 mm |
| Finished Copper Weight | 1 oz (1.4 mils) on outer layers |
| Via Plating Thickness | 20 µm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Electrical Testing | 100% electrical test conducted prior to shipment |
4. PCB Stackup
Copper Layer 1: 35 µm
RO4360G2 Substrate: 8 mil (0.203 mm)
Copper Layer 2: 35 µm
5.PCB Statistics
Components: 18
Total Pads: 57
Thru Hole Pads: 39
Top SMT Pads: 18
Bottom SMT Pads: 0
Vias: 51
Nets: 2
6.Manufacturing & Compliance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2 compliant
Availability: Worldwide production and shipping
7.Typical Applications
Base station power amplifiers
Small cell transceivers