RF-10 2-Layer 0.75mm Thick PCB for High-Dk RF & Microwave Applications
1.Introduction of RF-10
RF-10 copper clad laminates are composites of ceramic-filled PTFE and woven fiberglass. RF-10 offers the advantage of a high dielectric constant and low dissipation factor. The use of thin woven fiberglass reinforcement provides both low dielectric loss and improved rigidity for easier handling, as well as enhanced dimensional stability for multilayer circuits.
RF-10 laminates are engineered to deliver a cost-effective substrate with industry-acceptable lead times. RF-10 meets the need for size reduction in RF applications. It bonds well to smooth low-profile copper, and its low dissipation factor, combined with very smooth copper, results in optimal insertion loss performance at higher frequencies where skin effect losses are significant.
2.Key Features
Dielectric Constant: 10.2 ±0.3 at 10GHz
Dissipation Factor: 0.0025 at 10GHz
High Thermal Conductivity: 0.85 W/mK (Unclad)
CTE: x-axis 16 ppm/°C, y-axis 20 ppm/°C, z-axis 25 ppm/°C
Low Moisture Absorption: 0.08%
Flammability Rating: UL 94 V-0
3.Benefits of Using RF-10 in PCB Design
High Dk enables RF circuit miniaturization
Excellent dimensional stability
Tight Dk tolerance (10.2 ±0.3)
High thermal conductivity for improved thermal management
Strong adhesion to smooth copper surfaces
Low CTE in X, Y, Z directions
Excellent price-to-performance ratio
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RF-10 |
| Layer Count | 2-layer |
| Board Dimensions | 90mm x 70mm (±0.15mm) |
| Minimum Trace/Space | 6/6 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 0.75mm |
| Finished Cu Weight | 1oz (1.4 mils) |
| Via Plating Thickness | 20µm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1: 35µm (1oz)
RF-10 Core: 25mil (0.635mm)
Copper layer 2: 35µm (1oz)
6.PCB Statistics:
Components: 21
Total pads: 56
Through-hole pads: 41
Top SMT pads: 15
Bottom SMT pads: 0
Vias: 44
Nets: 2
7.Typical Applications
Microstrip patch antennas
GPS antennas
Passive components (filters, couplers, power dividers)
Aircraft collision avoidance systems
Satellite components
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
